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TRIQUINT[TriQuint Semiconductor]
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| Part No. |
TQTRX
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| OCR Text |
...red * Hot Lot Cycle Time * With thinning and sawing; optional backside vias Design Sensitivity Test (DST) Wafer Run * Yield Analysis * Design Sensitivity to Process Variation * 14 Wafer Start; Spread of Vp Values * *
TQTRp
Process Qua... |
| Description |
Advanced Passives & MESFET Foundry Service
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| File Size |
172.25K /
6 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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| Part No. |
TQHBT3
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| OCR Text |
...ule * 2 wafers delivered * With thinning and sawing; optional backside vias
* Process based on TQHBT2.5 production process. * Full wafer level, process and packaged part qualification complete for TQHBT3. Contact TriQuint for relevant re... |
| Description |
InGaP HBT Foundry Service
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| File Size |
116.93K /
6 Page |
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it Online |
Download Datasheet |
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TRIQUINT[TriQuint Semiconductor]
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| Part No. |
TQHBT
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| OCR Text |
...red * Hot Lot Cycle Time * With thinning and sawing; optional backside vias
* * * * *
Mature Process based on 10 GHz, 8V Vdd Process for Military Phased-Array Radar Applications. Over 10 Years of Reliability Data Collected. Process Qu... |
| Description |
Precision, 100UA Gain Selectable Amplifier
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| File Size |
259.37K /
5 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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| Part No. |
TQHIP
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| OCR Text |
...red * Hot Lot Cycle Time * With thinning and sawing; optional backside vias Design Sensitivity Test Run (DST): * Yield Analysis * Design Sensitivity to Process Variation * 14 Wafer Start; Spread of Vp and Cgs values
* *
*
TQHiP is ... |
| Description |
Precision, 100UA Gain Selectable Amplifier
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| File Size |
116.18K /
4 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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| Part No. |
TQPED
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| OCR Text |
...red * Hot Lot cycle time * With thinning and sawing; optional backside vias
* Mature process based on TQPHT 150-mm process * Process release to production scheduled for Q1 2005 * Full 150mm wafer Process Qualification in process. To be c... |
| Description |
Precision, 100UA Gain Selectable Amplifier
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| File Size |
96.58K /
3 Page |
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it Online |
Download Datasheet |
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TRIQUINT[TriQuint Semiconductor]
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| Part No. |
TQPHT
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| OCR Text |
...red * Hot Lot cycle time * With thinning and sawing; optional backside vias
Mature process based on TQTx, 150-mm process Process released to production Full 150mm wafer Process Qualification complete For more information on Quality and R... |
| Description |
0.5 um pHEMT Foundry Service
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| File Size |
204.87K /
5 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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| Part No. |
TQRLC
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| OCR Text |
...ule * 2 wafers delivered * With thinning and sawing * * *
TQRLC
Process Qualification Status
TQRLC is a fully-released process Reliability Reports * TQRLC Process Qualification * TQTRx Element Qualification Report For more informatio... |
| Description |
Advanced Passives Foundry Service
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| File Size |
391.85K /
3 Page |
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it Online |
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PANASONIC[Panasonic Semiconductor]
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| Part No. |
2SD2216L
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| OCR Text |
...ackage, allowing downsizing and thinning of the equipment and automatic insertion through the tape packing.
4 1.000.05 1
0.600.05
0.300.03
0.200.03
4
1
Parameter Collector-base voltage (Emitter open) Collector-emitter volta... |
| Description |
For General Amplification
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| File Size |
35.00K /
2 Page |
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it Online |
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PANASONIC[Panasonic Semiconductor]
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| Part No. |
2SB1462L
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| OCR Text |
...ackage, allowing downsizing and thinning of the equipment and automatic insertion through the tape packing
4 1.000.05 1
0.600.05
0.300.03
0.200.03
4
1
Parameter Collector-base voltage (Emitter open) Collector-emitter voltag... |
| Description |
For General Amplification
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| File Size |
35.03K /
2 Page |
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it Online |
Download Datasheet |
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Price and Availability
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