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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TLP2762B
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| Description |
Photocoupler (photo-IC output), 10 Mbps, 5000 Vrms, SO6L
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
71276-210HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-127-62LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 62 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86092327624765E1LF
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| Description |
DIN Straight Header Solder-to-Board Style R 32 ways, Class I
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-427-62LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 62 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91276-236HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-827-62LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 62 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86094327624755E1LF
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| Description |
DIN Straight Header Solder-to-Board Style R/2 32 ways, Class II
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| Tech specs |
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Official Product Page
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Price and Availability
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