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  solder-machined Datasheet PDF File

For solder-machined Found Datasheets File :: 244    Search Time::2.25ms    
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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMPA61810
OCR Text ...Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC Ground. These GaAs devices should be handled with care and stored in ...
Description 6-18 GHz 1W Power Amp
Single Channel 6-18 GHz 1 Watt Power Amplifier MMIC

File Size 544.49K  /  6 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWB04001
OCR Text ...Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC ground. These GaAs devices should be handled with care and stored in ...
Description 4 GHz Buffer Amplifier MMIC

File Size 105.53K  /  7 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWB11001
OCR Text ...Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC ground. These GaAs devices should be handled with care and stored in ...
Description 11 GHz Buffer Amplifier MMIC

File Size 349.24K  /  6 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWB12001
OCR Text ...Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC ground. These GaAs devices should be handled with care and stored in ...
Description 12 GHz Buffer Amplifier MMIC

File Size 195.44K  /  6 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWB24001
OCR Text ...Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC ground. These GaAs devices should be handled with care and stored in ...
Description 24 GHz Buffer Amplifier MMIC

File Size 91.67K  /  7 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWB33001
OCR Text ...Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC ground. These GaAs devices should be handled with care and stored in ...
Description 33 GHz Buffer Amplifier MMIC

File Size 228.15K  /  6 Page

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    RMWL38001

Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
Part No. RMWL38001
OCR Text ...Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC ground. These GaAs devices should be handled with care and stored in ...
Description 37-40 GHz Low Noise Amplifier MMIC

File Size 380.55K  /  7 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWP23001
OCR Text ...Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC ground. These GaAs devices should be handled with care and stored in ...
Description 23 GHz Power Amp
21-24 GHz Power Amplifier MMIC

File Size 288.69K  /  9 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMWP26001
OCR Text ...Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC ground. These GaAs devices should be handled with care and stored in ...
Description 24-26.5 GHz Power Amplifier MMIC

File Size 378.54K  /  8 Page

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    FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. RMWT11001
OCR Text ...Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF ground. These GaAs devices should be handled with care and stored in dry nit...
Description 11/33 GHz Tripler
11-33 GHz Tripler MMIC

File Size 118.89K  /  7 Page

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For solder-machined Found Datasheets File :: 244    Search Time::2.25ms    
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