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STMICROELECTRONICS[STMicroelectronics]
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| Part No. |
L9305A 1398
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| OCR Text |
...) are attached to the frame and remover the heat produced by the chip. Figure 2 and 3 show two ways of heatsinking. In the first case, a PC board copper area is used as a heatsink I = 65 mm. While in the second case, the device is soldered ... |
| Description |
From old datasheet system
DUAL HIGH CURRENT RELAY DRIVER
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| File Size |
118.43K /
6 Page |
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