PM-8083 pdf Datasheet P5 Part Num --- IC-ON-LINE


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PM-8083 Datasheet PDF File

For PM-8083 Found Datasheets File :: 73+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 |


Part No.	S-80857CLUA-B7I-T2 S-80822CLUA-B6H-T2 S-80836CLMC-B6V-T2 S-80836CLNB-B6V-T2
Description	1-CHANNEL POWER SUPPLY SUPPORT CKT, PSSO3 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO5 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO4
File Size	677.06K / 54 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-808361650LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Samsung Electronic
Part No.	M372V08083DJT0-CEDOMODE
Description	8M x 72 DRAM DIMM with ECC Using 8M x 8, 4K & 8K Refresh, 3.3V Data Sheet
File Size	413.21K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10144518-083802LF
Description	BergStak® Lite 0.80mm, Board-to-Board Connector, 80 Positions, Dual Row, Vertical Header.
Tech specs				Official Product Page

					Samsung Electronic
Part No.	M372F08083DJT0-CEDOMODE
Description	8M x 72 DRAM DIMM with ECC Using 8M x 8, 4K & 8K Refresh, 3.3V Data Sheet
File Size	463.01K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-808301350LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor]
Part No.	K4S280432F K4S280432F-TC75 K4S280432F-TL75 K4S281632F-TL75 K4S280832F-TC75 K4S280832F-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60
Description	RES, 16.9, 1/16W, TKF, 1%, 0603 TV 11C 11#12 PIN RECP 128MB F-DIE SDRAM SPECIFICATION
File Size	140.81K / 14 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-808361300LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor]
Part No.	K4S280432E K4S280432E-TL75 K4S280432E-TC75 K4S281632E-TL75 K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60
Description	128Mb E-die SDRAM Specification 128Mb的电子芯片内存规
File Size	142.99K / 14 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-808361500LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S281632F-UC75 K4S280432F-UC K4S280832F-UC75 K4S280832F-UL75 K4S281632F-UL75 K4S280432F-UC75 K4S280432F-UL75 K4S281632F-UC60 K4S281632F-UC60_75 K4S281632F-UL60 K4S281632F-UL60_75 K4S281632F-UC60/75 K4S281632F-UL60/75 K4S280432F-UC750 K4S281632F-UL750
Description	8M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54 32M X 4 SYNCHRONOUS DRAM, 5.4 ns, PDSO54 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 128Mb的的F -模与铅SDRAM的规4 TSOP-II免费（符合RoHS CAP 0.1UF 100V 10% X7R SMD-1206 TR-7-PL 3K/REEL
File Size	142.90K / 14 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G832MC010808322HR
Description	0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 18.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold Black.
Tech specs				Official Product Page

					Samsung Electronic Samsung semiconductor
Part No.	K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60 K4S281632E-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 K4S280432E-TC75 K4S280432E-TL75
Description	128Mb F-die SDRAM Specification 128Mb E-die SDRAM Specification
File Size	142.11K / 14 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G832MC030808322HR
Description	0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 18.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold White.
Tech specs				Official Product Page


Part No.	S-80824CNBB-B8J-TF B8H-TFG S-80847CNBB-B88-TF S-80816CNBB-B8B-TF S-80836CNBB-B8V-TF S-80827CLBB-B6M-TF
Description	1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO4 SNB-4
File Size	39.11K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G80830022DHR
Description	PCB Socket 2.54mm Pitch Rightangle DIP, 1x2Pin, 15u\\ Gold, NY6T, TAIL=3.2mm, TUBE
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S280832F-TC75 K4S280832F-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 TL431CDT K4S280432F-TCL75 K4S280832F-TCL75 K4S280432F-TC75 K4S281632F-TCL60 K4S281632F-TCL75 K4S280432F-TL75
Description	128Mb F-die SDRAM Specification 128Mb的的F - SDRAM内存芯片规格
File Size	143.50K / 14 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	UCC28083D
Description	Current Mode Push-Pull PWM With Programmable Slope Compensation 8-SOIC -40 to 85
Tech specs			Get Free Sample	Official Product Page

					Renesas Electronics Corporation
Part No.	HD64F38086R H838086R H8_38083R HD64338083R H8_38084R HD64338084R H8_38085R HD64338085R H8_38086R HD64338086R H8_38086RF
Description	Renesas 16-Bit Single-Chip Microcomputer H8 Family/H8/300H Super Low Power Series
File Size	3,870.71K / 697 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	UCC38083D
Description	Current Mode Push-Pull PWM With Programmable Slope Compensation 8-SOIC 0 to 70
Tech specs			Get Free Sample	Official Product Page

For PM-8083 Found Datasheets File :: 73+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 |

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