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Amphenol Communications Solutions |
| Part No. |
77313-185-70LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 70 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-8516-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-185-28LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 28 Positions
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| Tech specs |
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Official Product Page
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Avago Technologies, Ltd.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
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| Part No. |
MSA-1023
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| Description |
Cascadable Silicon Bipolar MMIC Amplifier(可级联的硅双极型单片式微波集成电路放大器) 级联硅双极MMIC放大器（可级联的硅双极型单片式微波集成电路放大器
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| File Size |
48.85K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77313-185-08LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-185R08LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-8516-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Agilent(Hewlett-Packard...
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
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| Part No. |
MSA-0170
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| Description |
Cascadable Silicon Bipolar MMIC Amplifier
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| File Size |
44.29K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-185-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 06 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-8514-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Avago Technologies, Ltd.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
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| Part No. |
MSA-0520
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| Description |
Cascadable Silicon Bipolar MMIC Amplifier 级联硅双极MMIC放大
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| File Size |
43.86K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-8518-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-185-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 14 Positions
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: MSA-3186 |
| Maker: AGILENT |
| Pack: SMT86 |
| Stock: Reserved |
| Unit price
for : |
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50: $2.77 |
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100: $2.63 |
| 1000:
$2.49 |
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Email: oulindz@gmail.com |
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Contact us |
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