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For methods. Found Datasheets File :: 34072    Search Time::5.031ms    
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    IE-70000-MC-NW-A

NEC
Part No. IE-70000-MC-NW-A
OCR Text ...ar with the functions and usage methods of the devices and have knowledge of debuggers. purpose the purpose of this manual is to describe the proper operation of the ie-70000-mc- nw-a and its basic specifications. organization this manual i...
Description External in-circuit emulator for micro-computer with on-chip debug unit

File Size 284.30K  /  29 Page

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    Osram Opto Semiconductors GmbH
Part No. LBE67C LBE67C-P2Q2-35 LBE67C-Q2S1-35
OCR Text ...tensity, wavelength  assembly methods: suitable for all smt assembly methods  soldering methods: ir reflow soldering and ttw soldering  preconditioning: acc. to jedec level 2  taping: 8 mm tape with 2000/reel, ? 180 mm or 8000/...
Description Power TOPLEDEnhanced optical Power LED (ATON

File Size 142.41K  /  15 Page

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    DCR806SG27 DCR806SG28 DCR806SG DCR806SG24 DCR806SG25 DCR806SG26

DYNEX[Dynex Semiconductor]
Part No. DCR806SG27 DCR806SG28 DCR806SG DCR806SG24 DCR806SG25 DCR806SG26
OCR Text ...customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operati...
Description Phase Control Thyristor

File Size 114.80K  /  8 Page

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    DCR818SG47 DCR818SG46 DCR818SG48 DCR818SG DCR818SG44 DCR818SG45

Dynex Semiconductor Ltd.
DYNEX[Dynex Semiconductor]
Part No. DCR818SG47 DCR818SG46 DCR818SG48 DCR818SG DCR818SG44 DCR818SG45
OCR Text ...omers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operati...
Description Phase Control Thyristor

File Size 108.66K  /  8 Page

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    DS1104SG27 DS1104SG30 DS1104SG DS1104SG26 DS1104SG28 DS1104SG29 DS1104SG25

Dynex Semiconductor, Ltd.
DYNEX[Dynex Semiconductor]
Part No. DS1104SG27 DS1104SG30 DS1104SG DS1104SG26 DS1104SG28 DS1104SG29 DS1104SG25
OCR Text ...omers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operati...
Description Rectifier Diode 1849 A, 2900 V, SILICON, RECTIFIER DIODE

File Size 94.85K  /  7 Page

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    DS1107SG37 DS1107SG39 DS1107SG40 DS1107SG38 DS1107SG36 DS1107SG35 DS1107SG

DYNEX SEMICONDUCTOR LTD
DYNEX[Dynex Semiconductor]
Part No. DS1107SG37 DS1107SG39 DS1107SG40 DS1107SG38 DS1107SG36 DS1107SG35 DS1107SG
OCR Text ...omers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operati...
Description Rectifier Diode

File Size 96.08K  /  7 Page

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    DS1109SG47 DS1109SG46 DS1109SG50 DS1109SG DS1109SG45 DS1109SG48 DS1109SG49

DYNEX[Dynex Semiconductor]
Part No. DS1109SG47 DS1109SG46 DS1109SG50 DS1109SG DS1109SG45 DS1109SG48 DS1109SG49
OCR Text ...omers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operati...
Description Rectifier Diode

File Size 96.53K  /  7 Page

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    DS1112SG57 DS1112SG DS1112SG55 DS1112SG56 DS1112SG58 DS1112SG59 DS1112SG60

DYNEX[Dynex Semiconductor]
Part No. DS1112SG57 DS1112SG DS1112SG55 DS1112SG56 DS1112SG58 DS1112SG59 DS1112SG60
OCR Text ...omers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operati...
Description Rectifier Diode

File Size 94.33K  /  7 Page

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    LBT673 LBT673-N2Q1-1

Osram Opto Semiconductors GmbH
OSRAM GmbH
Part No. LBT673 LBT673-N2Q1-1
OCR Text ...tensity, wavelength ? assembly methods: suitable for all smtassembly methods ? soldering methods: ir reflow soldering and ttw soldering ? preconditioning: acc. to jedec level 2 ? taping: 8 mm tape with 2000/reel, ? 180 mm or 8000/r...
Description HYPER TOPLED, HYPER BRIGHT LED 超TOPLED,超亮度LED

File Size 190.93K  /  15 Page

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    Panasonic
Part No. ERJ6DQF1R0V ERJ6DQF1R5V ERJ6DQF1R6V ERJ6DQF3R0V ERJ6DQF6R2V ERJ6DQF3R3V ERJ6DQF5R6V ERJ12ZQGR75U ERJL14UJ29MU ERJ6DQD9R53V ERJ3BWGR047V ERJ2BWGR056X ERJ3BWGR022V ERJ3BWGR068V ERJ3BWGR091V ERJL12UF30MU ERJL12UF38MU ERJL14UF37MU ERJL06UJ76MV ERJ6LWFR008V ERJL14UJ80MU ERJ12ZQJR22U ERJ2BQJR27X ERJ3BQJR27V ERJL12KJ20MU ERJL12KJ22MU ERJL03UF81MV ERJL06UF80MV ERJL03UF84MV ERJL06UJ83MV ERJL14UJ32MU ERJL14UJ34MU ERJ1TRQG6R8U ERJ3BQG6R8V ERJ12ZQG6R2U ERJL12UF55MU ERJL14UF55MU ERJL08UJ57MV ERJL14UJ57MU ERJL1DUJ57MU ERJ3BQF2R0V ERJ3BQF1R0V ERJ3BQFR33V ERJ3BQF5R1V ERJ3BQF6R8V ERJ12RQFR27U ERJ12RQFR24U ERJ12ZQFR51U ERJ12ZQFR68U ERJL03UF95MV ERJL06UF99MV ERJL08UF92MV ERJL08UF97MV ERJ12RQJ2R4U ERJ12RQJ3R0U ERJL03UF74MV ERJL06UF72MV ERJL06UF78MV ERJL08UF72MV ERJL14UF21MU ERJ14BQFR75U ERJ8BQFR75V ERJ6DQD2R20V ERJ6DQD2R74V ERJ6DQD2R80V ERJ6BQF1R1V ERJ6BQFR22V ERJ6BQF5R1V ERJ6BQFR30V ERJL08UF48MV ERJ8BQJ5R1V ERJ3BSJR13V ERJL08UF51MV ERJL08UF54MV ERJ14RQJ3R3U ERJ3RQJ3R0V ERJ12ZQGR27U ERJ8CWGR027V ERJ2BQGR33X ERJ3BQGR33V ERJ6DQDR750V ERJ6DQDR787V ERJ14RSJR13U
OCR Text ...7m resistance value packaging methods code packaging part no. x pressed carrier taping 2 mm pitch, 10,000 pcs. erj3lw erj6lw erj3bw erj6bw erj8bw erj6cw erj8cw erj2lw erj2bw v punched carrier taping 4 mm pitch, 5,000 pcs. code inch 2lw 3l...
Description Current Sensing Chip Resistors Thick Film Type

File Size 186.13K  /  8 Page

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For methods. Found Datasheets File :: 34072    Search Time::5.031ms    
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