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MINI[Mini-Circuits]
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| Part No. |
LOUIS-50
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| Description |
termination DIN 50?/a> DC to 2 GHz
termination DIN 50 DC to 2 GHz
From old datasheet system
termination DIN 50з DC to 2 GHz 0 MHz - 2000 MHz 50 ohm RF/MICROWAVE termination
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| File Size |
120.30K /
1 Page |
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it Online |
Download Datasheet
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http://
INFINEON[Infineon Technologies AG]
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| Part No. |
SBH52444G-FSAN SBH52444X SBH52444Z-FSAN SBH52444N-FSAN SBH52444P-FSAN SBH52444X-FSAN
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| Description |
high power BIDI Optical Standard Module 1310 nm Emitting/ 1550 nm Receiving
Components and FTTx solutions - Tx 1310nm/Rx 1550nm, 155 MBit/s TIA
high power BIDI Optical Standard Module 1310 nm Emitting 1550 nm Receiving
From old datasheet system
high power BIDI Optical Standard Module 1310 nm Emitting, 1550 nm Receiving
Snap-in Panel Mount Switch, Double Pole Double Throw (DPDT) Circuitry, 10 A at 277 Vac, Bullet Nose Plunger Actuator, Silver Contacts, Quick Connect termination
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| File Size |
277.23K /
13 Page |
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it Online |
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Analog Devices, Inc.
http://
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| Part No. |
AD8016ARE-EVAL AD8016ARB-EVAL AD8016ARB-REEL AD8016ARP AD8016ARP-REEL
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| Description |
Low power, high Output Current xDSL Line Driver
ER 6C 4#16 2#8 PIN RECP WALL
Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum Alloy; Connecting termination:Solder; Connector Shell Size:22; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No
Low power/ high Output Current xDSL Line Driver
Low power, high Output Current xDSL Line Driver DUAL OP-AMP, 3000 uV OFFSET-MAX, PDSO20
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| File Size |
570.91K /
20 Page |
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it Online |
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LAPIS SEMICONDUCTOR CO LTD
OKI SEMICONDUCTOR CO., LTD.
OKI[OKI electronic componets]
OKI electronic components
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| Part No. |
OL3204N-40 OL3201N-40
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| Description |
FIBER OPTIC LASER DIODE MODULE EMITTER, 1280-1330nm, THROUGH HOLE MOUNT, FC CONNECTOR
1.3 レm high-power Laser-Diode DIP Module 1.3レ米高功率激光二极管双酯模块
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT02; Number of Contacts:4; Connector Shell Size:8; Connecting termination:Solder; Circular Shell Style:Box Mount Receptacle 1.3レ米高功率激光二极管双酯模块
1.3 μm high-power Laser-Diode DIP Module
1.3 m high-power Laser-Diode DIP Module
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| File Size |
49.81K /
4 Page |
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it Online |
Download Datasheet |
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Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
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| Part No. |
MG75Q1ZS50 EA08930
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| Description |
Circular Connector; Body Material:Aluminum; Series:PT01; No. of Contacts:5; Connector Shell Size:10; Connecting termination:Solder; Circular Shell Style:Cable Receptacle; Circular Contact Gender:Pin; Insert Arrangement:10-5
N CHANNEL IGBT (high power SWITCHING / MOTOR CONTROL APPLICATIONS)
From old datasheet system
N CHANNEL IGBT (high power SWITCHING, MOTOR CONTROL APPLICATIONS)
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| File Size |
300.83K /
6 Page |
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it Online |
Download Datasheet |
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Price and Availability
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