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Powerex Power Semicondu...
POWEREX[Powerex Power Semiconductors]
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| Part No. |
RM300CA-9W
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| Description |
Fast Recovery Welder Diode Module (300 Amperes/450 Volts)
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| File Size |
64.71K /
2 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
L717HDC62P
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L777HDC62PVF
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L777HDC62PD1CH4R
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDC62SD1CH4R
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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Official Product Page
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INTEL[Intel Corporation]
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| Part No. |
80960CA-25 80960CA-16
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| Description |
SPECIAL ENVIRONMENT 80960CA-25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
SPECIAL ENVIRONMENT 80960CA-25 -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
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| File Size |
1,239.89K /
62 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
L717HDC62PC309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L717HDC62POL2C309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDC62SD1CH3RC309
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L777HDC62P
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDC62SOL2
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDC62SD1CH4R
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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Official Product Page
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Bom2Buy.com
Price and Availability
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