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DALLAS[Dallas Semiconductor]
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Part No. |
DS3174N DS3171 DS3171N DS3172 DS3172N DS3173 DS3173N DS3174
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OCR Text |
...High-Density Thermally Enhanced chipscale BGA Packaging (TE-CSBGA) with 1.27mm Pin Pitch Industrial Temperature Operation: -40C to +85C IEEE1149.1 JTAG Test Port
DETAILED DESCRIPTION
The DS3171 (single), DS3172 (dual), DS3173 (triple), ... |
Description |
Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers
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File Size |
2,009.27K /
232 Page |
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it Online |
Download Datasheet |
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MAXIM[Maxim Integrated Products]
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Part No. |
MAX2648EBT MAX2648
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OCR Text |
...device is packaged in a tiny 23 chipscale package (UCSPTM) with six solder bumps, measuring 1.0mm 1.5mm.
MAX2648
Ordering Information
PART MAX2648EBT TEMP. RANGE -40C to +85C PIN-PACKAGE 23 UCSP
Pin Configuration Applications
IE... |
Description |
From old datasheet system 5GHz to 6GHz Low-Noise Amplifier in 6-Pin UCSP
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File Size |
144.18K /
8 Page |
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it Online |
Download Datasheet |
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Vishay Intertechnology, Inc. VISAY[Vishay Siliconix]
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Part No. |
SI8402DB-T1 SI8402DB
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OCR Text |
... Power MOSFET D New MICRO FOOTr chipscale Packaging Reduces Footprint Area Profile (0.62 mm) and On-Resistance Per Footprint Area
APPLICATIONS
D PA, Battery and Load Switch for Portable Devices
MICRO FOOT
Bump Side View 3 D D 2 Back... |
Description |
20-V N-Channel 1.8-V (G-S) MOSFET 20 - V N -通道.8 V(GS)的MOSFET
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File Size |
88.60K /
6 Page |
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it Online |
Download Datasheet |
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Vishay Intertechnology, Inc. VISAY[Vishay Siliconix]
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Part No. |
SI8405DB
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OCR Text |
... Power MOSFET D New MICRO FOOTr chipscale Packaging Reduces Footprint Area Profile (0.62 mm) and On-Resistance Per Footprint Area
APPLICATIONS
D PA, Battery and Load Switch D Battery Charger Switch
MICRO FOOT
Bump Side View 3 D D 2 ... |
Description |
12-V P-Channel 1.8-V (G-S) MOSFET 12 - V P -通道.8 VGS)的MOSFET
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File Size |
79.83K /
5 Page |
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it Online |
Download Datasheet |
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Price and Availability
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