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  87832-1822 Datasheet PDF File

For 87832-1822 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87832-3220

Molex Electronics Ltd.
Part No. 87832-3220
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 32 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.53K  /  6 Page

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Amphenol Communications Solutions

Part No. 77315-418-22LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87832-3014

Molex Electronics Ltd.
Part No. 87832-3014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 30 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.93K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131318-2211100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    87832-1422

Molex Electronics Ltd.
Part No. 87832-1422
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 14 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap

File Size 367.60K  /  6 Page

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Amphenol Communications Solutions

Part No. 77311-822-00LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 00 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    87832-3016

Molex Electronics Ltd.
Part No. 87832-3016
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree, 30 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.92K  /  5 Page

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Amphenol Communications Solutions

Part No. 77313-818-22LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 22 Positions
Tech specs    

Official Product Page

    87832-5523

Molex Electronics Ltd.
Part No. 87832-5523
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Pick-and-Place Cap

File Size 386.42K  /  6 Page

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Amphenol Communications Solutions

Part No. G823MB18221KEU
Description Board mount - Header Plug - Box Header 2.0mm Pitch Vertical,SMT,2x9Pin,15u\\ Gold,NY4T,With Location Post,With CAP
Tech specs    

Official Product Page

    87832-3622

Molex Electronics Ltd.
Part No. 87832-3622
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Lead free, 36 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap

File Size 367.55K  /  6 Page

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Amphenol Communications Solutions

Part No. 77311-822-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    87832-4420

Molex Electronics Ltd.
Part No. 87832-4420
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree, 44 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.52K  /  6 Page

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Amphenol Communications Solutions

Part No. 77311-822-19LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    87832-3820

Molex Electronics Ltd.
Part No. 87832-3820
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 38 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.47K  /  6 Page

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Amphenol Communications Solutions

Part No. 77311-822-29LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    87832-1416

Molex Electronics Ltd.
Part No. 87832-1416
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 14 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.91K  /  5 Page

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Amphenol Communications Solutions

Part No. 10127819-18222LF
Description Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 100u\\ Bright Tin plating, Black Color, 18 Positions, LCP, Non GW Compatible, Tray Packing.
Tech specs    

Official Product Page

    87832-1420

Molex Electronics Ltd.
Part No. 87832-1420
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 14 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.54K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131319-1822100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 18 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

For 87832-1822 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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