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  87338-1611 Datasheet PDF File

For 87338-1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    2SA1611-T1

NEC
Part No. 2SA1611-T1
Description Silicon transistor

File Size 199.68K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-6116-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Electronic Theatre Controls, Inc.
ETC[ETC]
Part No. UL1611N UL1611
Description UKLAD SCALONY ANALOGOWY UKLAD SCALONY ANALOGOWY

File Size 220.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6116-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    Microsemi
Part No. LXM1611-01
Description CCFL Inverter Module - Single Lamp

File Size 159.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021611-00012T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
Tech specs    

Official Product Page

    Macronix International Co., Ltd.
Part No. 23C1611-10 23C1611-12
Description 5 Volt 16-Mbit (2M x 8 / 1M x 16) Mask ROM with Page Mode

File Size 475.67K  /  9 Page

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Amphenol Communications Solutions

Part No. 20021611-00030T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 30 contacts
Tech specs    

Official Product Page

   
Part No. 23C1611
Description From old datasheet system

File Size 104.08K  /  7 Page

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Amphenol Communications Solutions

Part No. 87916-113HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

   
Part No. 23L1611
Description From old datasheet system

File Size 57.01K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021611-00040T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
Tech specs    

Official Product Page

   
Part No. 29L1611
Description From old datasheet system

File Size 208.82K  /  36 Page

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Amphenol Communications Solutions

Part No. 87916-111HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

    Hantronix
Part No. DM16116
Description Search --To HDM16116

File Size 53.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021611-00008T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 8 contacts
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. KS16118
Description 9600bps FAX super one-chip(9600bps传真调制解调 9600bps传真超级单芯片(9600bps传真调制解调器)

File Size 27.07K  /  3 Page

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Amphenol Communications Solutions

Part No. U90H161100A
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP 12.73MM HS 1X1.
Tech specs    

Official Product Page

    Panasonic
Part No. 2SD1611
Description Power Device - Power Transistors - General-Purpose power amplification

File Size 84.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-3516-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 87338-1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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