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  8557 Datasheet PDF File

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. S5T8557B01-D0B0
Description 1 CHIP CODEC

File Size 84.93K  /  14 Page

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Amphenol Communications Solutions

Part No. 10078557-101LF
Description ZipLine® Vertical Orthogonal Header Assembly 6-Pair, 6 IMLA
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Analog Devices, Inc.
Part No. AD85561 AD85551 AD85531 AD85571
Description 10 MHz, 20 V/レs, G = 1, 10, 100, 1000 i CMOSProgrammable Gain Instrumentation Amplifier

File Size 217.68K  /  10 Page

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Amphenol Communications Solutions

Part No. 10158557-R302111LF
Description FlexLock® 2.54mm, Signal FPC-to-Board Connector Platform, Board Header, 30 Position, Top Latch, Tin (preplated)
Tech specs    

Official Product Page

    KT8554BD KT8554BJ KT8554 KT8554B KT8557BN KT8557B KT8554BN

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. KT8554BD KT8554BJ KT8554 KT8554B KT8557BN KT8557B KT8554BN
Description    1 CHIP CODECS
MU-LAW, PCM CODEC, PDIP16

File Size 150.41K  /  10 Page

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Amphenol Communications Solutions

Part No. 10158557-R282111LF
Description FlexLock® 2.54mm, Signal FPC-to-Board Connector Platform, Board Header, 28 Position, Top Latch, Tin (preplated)
Tech specs    

Official Product Page

    012-8554-000 012-8556-000 030-8588-000 030-8588-006 030-8588-010 030-8588-054 031-8558-000 031-8557-020 031-8557-026 031

ITT Industries
Part No. 012-8554-000 012-8556-000 030-8588-000 030-8588-006 030-8588-010 030-8588-054 031-8558-000 031-8557-020 031-8557-026 031-8557-000 030-8591-000 031-8639-120 030-8614-020 031-8520-000 031-8521-010 031-8521-020 031-8521-030 031-8555-110 031-8519-010 030-8586-000 030-8586-006 030-8614-010 030-8614-000 030-8612-010 030-8612-000 030-8587-000 030-8587-006 030-8585-000 031-8556-115 031-8556-120 030-8587-030 031-8557-006
Description cannon ca-bayonet connectors in accordance with vg95234

File Size 1,658.24K  /  56 Page

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Amphenol Communications Solutions

Part No. 10158557-R122121LF
Description FlexLock® 2.54mm, Signal FPC-to-Board Connector Platform, Board Header, 12 Position, Top Latch, Tin (preplated)
Tech specs    

Official Product Page

    85572-0116 85572-0117 85572-0124 85572-0109 85572-0115 85572-0125 85572-0106 85572-0110 85572-0118 85572-0119 85572-0122

Molex Electronics Ltd.
Part No. 85572-0116 85572-0117 85572-0124 85572-0109 85572-0115 85572-0125 85572-0106 85572-0110 85572-0118 85572-0119 85572-0122 85572-0112 85572-0102 85572-0105 85572-0111 85572-0104 85572-0107 85572-0108 85572-0123 85572-0114 85572-0121 85572-0103 85572-0113
Description HyperJackTM 1000 (Gigabit) stacked

File Size 162.90K  /  2 Page

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Texas Instruments

Part No. LM48557TLX/NOPB
Description Mono, Bridge-Tied Load, Ceramic Speaker Driver with I<sup>2</sup>C Volume Control and Reset 16-DSBGA
Tech specs    

Official Product Page

    85572-0027 85572-0028 85576-0001 85576-0002 85576-0003 85576-0004 85576-0005 85576-0006 85576-0007 85576-0014 85576-0015

Molex Electronics Ltd.
Part No. 85572-0027 85572-0028 85576-0001 85576-0002 85576-0003 85576-0004 85576-0005 85576-0006 85576-0007 85576-0014 85576-0015 85576-0016 85576-0017 85576-0018 85576-0019 85576-0020 85576-0021 85576-0022 85576-0023 85576-0024 85576-0025 85576-0026 85576-009 85576-0008
Description HyperJackTM 1000 (Gigabit) stacked In Line Power

File Size 217.17K  /  2 Page

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Texas Instruments

Part No. ADS8557IPMR
Description 670kSPS 14-Bit 6-Channel Simultaneous-Sampling ADC 64-LQFP -40 to 125
Tech specs    

Official Product Page

    0031.8221 0031.8222 0031.8225 0031.8263 0031.8264 0031.8265 0031.8273 0031.8274 0031.8275 OGN-SMD 0031.8556-ND 0031.8559

Schurter Inc.
Part No. 0031.8221 0031.8222 0031.8225 0031.8263 0031.8264 0031.8265 0031.8273 0031.8274 0031.8275 OGN-SMD 0031.8556-ND 0031.8559-ND 0031.8518-ND 0031.8557-ND 0031.8565-ND 0031.8514-ND 0031.8515-ND 0031.8513-ND 0031.8568-ND 0031.8566-ND 0031.8516-ND 0031.8558-ND 0031.8555-ND 0031.8517-ND 0031.8567-ND
Description Fuseholder Open Design, 5 x 20 mm, SMD, var. Covers, IEC 60335-1

File Size 509.17K  /  3 Page

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Texas Instruments

Part No. LM48557UR/NOPB
Description Mono, Bridge-Tied Load, Ceramic Speaker Driver with I<sup>2</sup>C Volume Control and Reset 16-DSBGA
Tech specs    

Official Product Page

    MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
Part No. MAX8557ETE MAX8556 MAX8556ETE MAX8557
Description PLASTIC ENCAPSULATED DEVICES
4A Ultra-Low-Input-Voltage LDO Regulators

File Size 225.77K  /  11 Page

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Texas Instruments

Part No. LP8557IAYFQT
Description High-Efficiency LED Backlight Driver for Tablets 16-DSBGA -30 to 85
Tech specs    

Official Product Page

    S5T8557B01-D0B0 S5T8557B01-S0B0 S5T8557B02-L0B0 S5T8554B S5T8554B01 S5T8554B01-D0B0 S5T8554B01-S0B0 S5T8554B02-L0B0 S5T8

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. S5T8557B01-D0B0 S5T8557B01-S0B0 S5T8557B02-L0B0 S5T8554B S5T8554B01 S5T8554B01-D0B0 S5T8554B01-S0B0 S5T8554B02-L0B0 S5T8557B01
Description Series 942-T, 1500 mm [59.0 in] scan distance, M30 plastic housing , connector termination, one analog output (4 mA to 20 mA or 0 Vdc to 10 Vdc), two PNP switching outputs and an RS232 digital link
1 CHIP CODEC Data Sheet

File Size 123.93K  /  14 Page

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Texas Instruments

Part No. ADS8557IPM
Description 670kSPS 14-Bit 6-Channel Simultaneous-Sampling ADC 64-LQFP -40 to 125
Tech specs    

Get Free Sample

Official Product Page

    B39182B8557P810

TDK Electronics
Part No. B39182B8557P810
Description SAW Duplexer

File Size 282.33K  /  15 Page

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Texas Instruments

Part No. LP8557AYFQT
Description High-Efficiency LED Backlight Driver for Tablets 16-DSBGA -30 to 85
Tech specs    

Official Product Page

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