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  73780-3163 Datasheet PDF File

For 73780-3163 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    73780-0233

Molex Electronics Ltd.
Part No. 73780-0233
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 2.50mm (.098),

File Size 202.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163402PLF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73780-0223

Molex Electronics Ltd.
Part No. 73780-0223
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 2.00mm (.079),

File Size 201.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 91901-31631LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 31 Positions.
Tech specs    

Official Product Page

    73780-0244

Molex Electronics Ltd.
Part No. 73780-0244
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 14.00mm (.551), Pin Length 3.00mm (.118),

File Size 202.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6316-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    73780-0234

Molex Electronics Ltd.
Part No. 73780-0234
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 14.00mm (.551), Pin Length 2.50mm (.098),

File Size 202.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 75168-316-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73780-0224

Molex Electronics Ltd.
Part No. 73780-0224
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted

File Size 202.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163400LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    73780-2267

Molex Electronics Ltd.
Part No. 73780-2267
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 17.00mm (.669), Pin Length 4.00mm (.157),

File Size 198.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    73780-4143

Molex Electronics Ltd.
Part No. 73780-4143
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 60 Circuits, Mounted Height 13.00mm (.511), Pin Length 3.00mm (.118),Press Fit

File Size 159.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    73780-3156 SD-73780-001

Molex Electronics Ltd.
Part No. 73780-3156 SD-73780-001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle
2.00mm (.079") Pitch HDM庐 Board-to-Board Daughtercard Receptacle
2.00mm (.079") Pitch HDM垄莽 Board-to-Board Daughtercard Receptacle

File Size 194.15K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163622LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    Microsemi
Part No. TD3163
Description Solar Array Diode

File Size 42.50K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-6314-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    JALCO Co., Ltd.
Part No. YKC21-3163 YKC21-3165
Description RCA, JACK

File Size 66.46K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-6318-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 73780-3163 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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