6436 pdf Datasheet P5 Part Num --- IC-ON-LINE


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6436 Datasheet PDF File

For 6436 Found Datasheets File :: 79+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 |

					Samsung semiconductor
Part No.	K7N641845M K7N641845M-FC16 K7N641845M-FC25 K7N641845M-QC16 K7N641845M-QC25 K7N643645M K7N643645M-FC16 K7N643645M-FC25 K7N643645M-QC16 K7N643645M-QC25
Description	2Mx36 & 4Mx18 Pipelined NtRAM
File Size	447.74K / 24 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87606-436LF
Description	Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 72 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Samsung semiconductor
Part No.	K7I643684M-FCI16 K7I641884M-FCI16 K7I641884M-FCI20 K7I643684M-FCI20
Description	72Mb DDRII SRAM Specification
File Size	412.68K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68016-436HLF
Description	BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100) Pitch.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K7I643682M07 K7I641882M
Description	2Mx36 & 4Mx18 DDRII CIO b2 SRAM
File Size	413.02K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68016-436H
Description	BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100) Pitch.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K7J643682M07 K7J641882M
Description	2Mx36 & 4Mx18 DDR II SIO b2 SRAM
File Size	429.81K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	RJE591886436N
Description	Modular Jack - 8P8C, RA, Cat6, THR, Standard Profile, Single Port, Shield With No EMI Tabs, With LEDs
Tech specs				Official Product Page

					Omron Electronics LLC
Part No.	XG5M-5035-N XG5S-1001 XG5S-1301 XG5S-1501 XG5S-1701 XG5M-2035-N XG5M-5033-N XG5M-5032-N XG5M-1035-N XG5M-163-N XG5M-1435-N XG5M-6432-N XG5M-343-N XG5M-6036-N XG5M-2635-N XG5M-3435-N XG5M-303-N XG5M-1034-N XG5M-3035-N XG5M-1032-N XG5M-3432-N XG5M-103-N XG5M-1031-N XG5M-3032-N XG5M-603-N XG5M-6032-N XG5M-6035-N XG5M-6033-N XG5M-403-N XG5M-4035-N XG5M-503-N XG5M-5036-N XG5M-203-N XG5M-2032-N XG5M-1632-N XG5M-1635-N XG5M-4032-N XG5S-0501 XG5S-2001 XG5S-3001 XG5S-2501 XG5S-0801 XG5S-3201 XG5M-263-N XG5M-2632-N XG5M-643-N XG5M-6433-N XG5M-6435-N XG5M-6436-N XG5M-143-N XG5M-1432-N XG5S-0701
Description	IDC Sockets for Discrete Wires
File Size	953.07K / 10 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	67996-436HLF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor]
Part No.	K7I643682M-FC30 K7I641882M K7I641882M-EI16 K7I641882M-EI20 K7I641882M-EI25 K7I641882M-EI30 K7I641882M-FC16 K7I641882M-FC20 K7I641882M-FC25 K7I641882M-FC30 K7I643682M K7I643682M-EI16 K7I643682M-EI20 K7I643682M-EI25 K7I643682M-EI30 K7I643682M-FC16 K7I643682M-FC20 K7I643682M-FC25
Description	72Mb M-die DDRII SRAM Specification 165 FBGA with Pb & Pb-Free (RoHS compliant)
File Size	301.37K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68466-436HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
Tech specs				Official Product Page

					Integrated Silicon Solution, Inc.
Part No.	IS61LP6432A-133TQ IS61LP6432A-133TQLI IS61LP6432A-133TQI IS61LP6436A-166TQLI
Description	64K x 32, 64K x 36 SYNCHRONOUS PIPELINED STATIC RAM
File Size	110.88K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	91276-436HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor] SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K7R640982M K7R643682M K7R641882M
Description	2Mx36 & 4Mx18 & 8Mx9 QDRTM II b2 SRAM
File Size	362.84K / 19 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68016-436
Description	BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100) Pitch.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K7R643684M07 K7R641884M K7R641884M-FC200 K7R641884M-FI250
Description	2Mx36 & 4Mx18 QDR II b4 SRAM 4M X 18 QDR SRAM, 0.45 ns, PBGA165
File Size	446.19K / 19 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	RJE601886436N
Description	Modular Jack - 8P8C, Right Angle, Cat6A, THR, Standard Profile, Single Port, Shield With No EMI Tabs, With LEDs
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
Part No.	K7J641882M K7J643682M K7J641882M-FC16 K7J641882M-FC20 K7J641882M-FC25 K7J641882M-FC30 K7J643682M-FC16 K7J643682M-FC20 K7J643682M-FC25 K7J641882M-FECI16 K7J641882M-FECI25 K7J641882M-FECI20 K7J641882M-FECI30 K7J643682M-FECI16 K7J643682M-FECI20 K7J643682M-FECI25 K7J643682M-FECI30 K7J643682M-FC30
Description	72Mb M-die DDRII SRAM Specification 72Mb的M -模条DDRII规格的SRAM
File Size	318.96K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	RJE581886436N
Description	Modular Jack - 8P8C, Right Angle, Cat5e, THR, Standard Profile, Single Port, Shield With No EMI Tabs, With LEDs
Tech specs				Official Product Page

For 6436 Found Datasheets File :: 79+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 |

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