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Amphenol Communications Solutions |
| Part No. |
54111-805360850LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-105360800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-105360850LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95079-04CA
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| Description |
Mechanism, 4mm s/o, Right Push Rod Eject, with EMI Clip, Narrow Body
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95079-05CA
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| Description |
Mechanism, 5mm s/o, Right Push Rod Eject, with EMI Clip, Narrow Body
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95079-02CALF
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| Description |
Mechanism, 2mm s/o, Right Push Rod Eject, with EMI Clip, Narrow Body
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0780790011 78079-0011
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| Description |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76渭m (30渭) Gold (Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76μm (30μ) Gold (Au) Plating
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| File Size |
809.46K /
10 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
95079-02CA
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| Description |
Mechanism, 2mm s/o, Right Push Rod Eject, with EMI Clip, Narrow Body
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0780790012 78079-0012
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| Description |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76渭m (30渭) Gold (Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76μm (30μ) Gold (Au) Plating
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| File Size |
809.46K /
10 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10079008-306LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, Off Set Legs 5.08mm (0.200in), 12 Position ,2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0534260790 53426-0790
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| Description |
2.50mm (.098) Pitch Mini-Lock?/a> Wire-to-Board Header, Right Angle, Friction and Positive Lock, Radial Tape Packaging, 7 Circuits, Lead-free
2.50mm (.098") Pitch Mini-Lock垄芒 Wire-to-Board Header, Right Angle, Friction and Positive Lock, Radial Tape Packaging, 7 Circuits, Lead-free
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| File Size |
295.81K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95079-05FA
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| Description |
Mechanism, 5mm s/o, Right Push Rod Eject, with EMI Clip, Narrow Body
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0780790052 78079-0052
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| Description |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38渭m (15渭) Gold(Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38μm (15μ) Gold(Au) Plating
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| File Size |
809.49K /
10 Page |
View
it Online |
Download Datasheet |
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