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  51111-0310 Datasheet PDF File

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    0511110800

Molex Electronics Ltd.
Part No. 0511110800
Description 2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, WithRetainer, 8 Circuits
File Size 98.33K  /  2 Page

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Murata Manufacturing Co Ltd
Part No. SCC433T-K03-10
Description 2-Axis Gyro, 3-axis Accelerometer combination sensor
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0459851111 45985-1111

Molex Electronics Ltd.
Part No. 0459851111 45985-1111
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Header, Right Angle,10 Power Contacts, 12 Signal Contacts, Select Gold (Au) Plating, for 3.18mm (.125) Thick PC Board
File Size 480.57K  /  7 Page

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Murata Manufacturing Co Ltd
Part No. SCR410T-K03-10
Description 1-Axis Gyro Sensor
Tech specs 　 　

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    51111-0810 0511110810

Molex Electronics Ltd.
Part No. 51111-0810 0511110810
Description 2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, withoutRetainer, 8 Circuits
File Size 94.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 78511-119HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs 　 　

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    0511110500 51111-0500

Molex Electronics Ltd.
Part No. 0511110500 51111-0500
Description 2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, WithRetainer, 5 Circuits
2.50mm (.098") Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, WithRetainer, 5 Circuits
File Size 98.53K  /  2 Page

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Amphenol Communications Solutions
Part No. 89075-1111LF
Description 4 Row Signal Header, Straight, Press-Fit, 4 Mod
Tech specs 　 　

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    0351111612

Molex Electronics Ltd.
Part No. 0351111612
Description 1.78mm (.070) Tab Wire-to-Board TPA? 5.00mm (.197) Pitch, 16 Circuits
File Size 59.84K  /  2 Page

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Amphenol Communications Solutions
Part No. 10136647-051111LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Natural Color, 5 Positions, GW Compatible, with Posts, Tray packing.
Tech specs 　 　

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    ASI[Advanced Semiconductor]
Part No. 5082-0310
Description SILICON STEP RECOVERY DIODE
File Size 13.86K  /  1 Page

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Amphenol Communications Solutions
Part No. 78511-118HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
Tech specs 　 　

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    T-10310

Rhombus Industries Inc.
Part No. T-10310
Description T1/CEPT PULSE TRANSFORMER
File Size 26.71K  /  1 Page

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Amphenol Communications Solutions
Part No. 10137785-051111LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Natural Color, 5 Positions, GW Compatible, with Post, Tray packing.
Tech specs 　 　

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    New Jersey Semi-Conductor Products, Inc.
Part No. 40310
Description Si NPN Power BJT
File Size 80.30K  /  1 Page

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Amphenol Communications Solutions
Part No. 78511-111HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch.
Tech specs 　 　

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    Transwitch
Part No. TXC-03109
Description 8-Channel E1 Framer
File Size 2,935.69K  /  284 Page

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Amphenol Communications Solutions
Part No. G880051111C1HR
Description Board mount - Header Receptacle - Wire to Board 1.25mm Pitch Vertical SMT,1x5Pin,Matte Tin,NY6T,Color-black ,T&R With MYLAR
Tech specs 　 　

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    INA-03100

http://
Agilent(Hewlett-Packard)
Agilent (Hewlett-Packard)
Part No. INA-03100
Description Low Noise/ Cascadable Silicon Bipolar MMIC Amplifier
Low Noise, Cascadable Silicon Bipolar MMIC Amplifier
File Size 45.13K  /  3 Page

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Amphenol Communications Solutions
Part No. 78511-113HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

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