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JRC9D PT270S15 H6507NL 1044470 1N5969C 1920H 3KP12CA IN4821
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  44432-2203 Datasheet PDF File

For 44432-2203 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0444321402 44432-1402

Molex Electronics Ltd.
Part No. 0444321402 44432-1402
Description 3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg
File Size 223.95K  /  5 Page

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Amphenol Communications Solutions
Part No. 93944-432HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 32 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0444321401 44432-1401

Molex Electronics Ltd.
Part No. 0444321401 44432-1401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 14 Circuits, Tin (Sn) Plating
File Size 223.89K  /  5 Page

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Amphenol Communications Solutions
Part No. 71922-034LF
Description Quickie®, Wire to Board connectors, Double Row, 34Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header.
Tech specs 　 　

Official Product Page

    0444321403 44432-1403

Molex Electronics Ltd.
Part No. 0444321403 44432-1403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 223.94K  /  5 Page

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Amphenol Communications Solutions
Part No. 68002-203HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0444322002 SD-44432-001 44432-2002

Molex Electronics Ltd.
Part No. 0444322002 SD-44432-001 44432-2002
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg
File Size 223.95K  /  5 Page

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Amphenol Communications Solutions
Part No. 10143702-203KLF
Description Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 3 Position,side to side,Top latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs 　 　

Official Product Page

    0444320401 SD-44432-001 44432-0401

Molex Electronics Ltd.
Part No. 0444320401 SD-44432-001 44432-0401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB
3.00mm (.118") Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB
File Size 155.53K  /  4 Page

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Amphenol Communications Solutions
Part No. 61082-203602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs 　 　

Official Product Page

    0444320402 SD-44432-001 44432-0402

Molex Electronics Ltd.
Part No. 0444320402 SD-44432-001 44432-0402
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible
File Size 224.13K  /  5 Page

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Amphenol Communications Solutions
Part No. 61082-203409LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs 　 　

Official Product Page

    VMMK-2203

Broadcom Corporation.
AVAGO TECHNOLOGIES LIMI...
Part No. VMMK-2203
Description 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package
File Size 766.56K  /  11 Page

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Amphenol Communications Solutions
Part No. 61082-203422LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs 　 　

Official Product Page

    AVG Semiconductors(HITE...
Part No. VMMK-2203
Description E-pHEMT Amplifier in a Wafer Scale Package (1 - 10GHz)
File Size 175.66K  /  2 Page

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Amphenol Communications Solutions
Part No. 77311-822-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    Honeywell International, Inc.
Part No. 52203
Description ULTRASONIC SENSOR 超声波传感器
File Size 75.20K  /  2 Page

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Amphenol Communications Solutions
Part No. 77311-422-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

   
Part No. 22033
Description Nonvolatile Controller Chip
File Size 1,957.06K  /  52 Page

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Amphenol Communications Solutions
Part No. 77315-422-03LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

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