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Maxim Integrated Products, Inc.
MAXIM - Dallas Semiconductor
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| Part No. |
MAX1428ETN MAX1428
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| Description |
15-Bit, 80Msps ADC with -78.4dBFS Noise Floor for IF Applications 15位0Msps ADC，具78.4dBFS的噪底，适合IF系统
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| File Size |
715.46K /
18 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
89891-428LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 56 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0878311428 87831-1428
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot
2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot
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| File Size |
189.23K /
4 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68001-428HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 28 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2816 0879142816
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.54K /
48 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-414281400LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 28 position, 2.54mm (0.100in) pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68691-428HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 28 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2815 0879142815
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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| File Size |
3,777.37K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68491-428HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 28 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-428HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10142801-00005LF
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| Description |
Minitek®2.5, Wire to Board Connectors, Single Row, Receptacle Housing, 5 Position.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68031-428HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
94611-428HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
71991-428LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry, 56 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Bom2Buy.com
Price and Availability
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