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  wafer-frame Datasheet PDF File

For wafer-frame Found Datasheets File :: 1121    Search Time::1.672ms    
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    Microchip
Part No. MCRF355 MCRF360
OCR Text ...ry low power cmos design  die, wafer, bumped wafer, cob, pdip or soic package options application  book store and library book id  airli...frame, pdip, soic and cob modules. note: information provided herein is preliminary and subject to c...
Description The MCRF355 is a uniquely designed read-only passive Radio Frequency Identification (RFID) IC device with advanced anticollision features optimized at 13.56 MHz. The device is powered remotely by rectifying RF magnetic fields that are tran
The MCRF360 is a uniquely designed read-only passive Radio Frequency Identification (RFID) IC device with advanced anticollision features operating at 13.56 MHz. The device is powered remotely by rectifying RF magnetic fields that are tran

File Size 560.52K  /  22 Page

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    T337P6-SD-F

Vishay Siliconix
Part No. T337P6-SD-F
OCR Text ...emarks package form t337p6-sd-f wafer sawn on foil wi th disco frame moq: 150 000 pcs chip absolute maximum ratings (t amb = 25 c, unless otherwise specified) parameter test condition symbol value unit reverse voltage v r 60 v junction te...
Description    Silicon PIN Photodiode

File Size 112.59K  /  5 Page

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    T1187P6-SD-F

Vishay Siliconix
Part No. T1187P6-SD-F
OCR Text ...marks package form t1187p6-sd-f wafer sawn on foil wi th disco frame moq: 330 000 pcs chip absolute maximum ratings (t amb = 25 c, unless otherwise specified) parameter test condition symbol value unit reverse voltage v r 60 v junction te...
Description Silicon PIN Photodiode

File Size 97.73K  /  5 Page

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    MF1S5031XDUD MF1S5000XDA8 MF1S5030XDA8

NXP Semiconductors
Part No. MF1S5031XDUD MF1S5000XDA8 MF1S5030XDA8
OCR Text ...-byte nuid ? bumped die on sawn wafer ? moa4 and moa8 contactless module 2. features and benefits 2.1 eeprom 3. applications 4. quic...frame carrier, electronic fail die marking according to secs-ii fo rmat), au bumps, 7-byte uid - mf...
Description MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development

File Size 794.95K  /  40 Page

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    MF1S7001XDUD MF1S7000XDA4 MF1S7000XDA8 MF1S7030XDA4 MF1S7030XDA8

NXP Semiconductors
Part No. MF1S7001XDUD MF1S7000XDA4 MF1S7000XDA8 MF1S7030XDA4 MF1S7030XDA8
OCR Text ...t card ic ? bumped die on sawn wafer ? moa4 and moa8 contactless module 2. features and benefits 2.1 eeprom 3. applications 4. quic...frame carrier, electronic fail die marking according to secs-ii fo rmat), au bumps, 7-byte uid - mf...
Description MIFARE Classic 4K - Mainstream contactless smart card IC for fast and easy solution development

File Size 796.76K  /  41 Page

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    SMP1353-099 SMP1322-099 SMP1340-099

Skyworks Solutions Inc.
Part No. SMP1353-099 SMP1322-099 SMP1340-099
OCR Text ...099 Quantity of Good Diodes Per Wafer Bonding Pad Min. Nom. 40,000 46,000 40,000 65,000 65,000 40,000 40,000 46,000 72,000 72,000 46,000 46,...FRAME Typical Performance Data at 25 C 1000 SMP1320 0.30 SMP1353 0.25 Series Resistance () ...
Description PIN Diode Chips Supplied on Film Frame

File Size 184.38K  /  5 Page

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    T330P-14

Vishay Siliconix
Part No. T330P-14
OCR Text ... h in mm): 0.67 x 0.67 x 0.28 ? wafer diameter (in mm): 100 ? radiant sensitive area (in mm 2 ): 0.23 ? peak sensitivity wavelength: 900 nm ...frame moq: 55 000 pcs chip absolute maximum ratings (t amb = 25 c, unless otherwise specified) par...
Description Silicon PIN Photodiode

File Size 78.17K  /  4 Page

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    SMS3927-099 SMS3928-099 SMS3926-099

Skyworks Solutions Inc.
Part No. SMS3927-099 SMS3928-099 SMS3926-099
OCR Text ...n and supplied on film frame in wafer quantities. Absolute Maximum Ratings Characteristic Forward current (IF) Power dissipation @ 25 C at the base of the chip Storage temperature Operating temperature ESD human body model Value 75 mA 7...
Description Schottky Diode Quad Mixer Chips Supplied on Film Frame

File Size 255.63K  /  5 Page

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For wafer-frame Found Datasheets File :: 1121    Search Time::1.672ms    
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