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VISHAY INTERTECHNOLOGY INC
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| Part No. |
SC202H045A5B SC202R030A5B
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| OCR Text |
...25c sc202....5 b . inked probed unsawn wafer (wafer in box) 48 device t j max. v r max. i r @ 25c (*) max. v f @ i f # (c) (v) (ma) (v) electrical characteristics device metal thickness metal thickness # front metal back metal sc202...... |
| Description |
45 V, SILICON, RECTIFIER DIODE
30 V, SILICON, RECTIFIER DIODE
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| File Size |
131.01K /
5 Page |
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it Online |
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INFINEON[Infineon Technologies AG]
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| Part No. |
SIPC42S2N08
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| OCR Text |
...allel connection Ordering Code
unsawn wafer on foil sawn wafer on foil surf tape
DESCRIPTION
* Assembly by epoxy die bonding or soldering * AQL 1.5 for visual inspection according to failure catalog A67207-A7001-A001 issue C on 100% meas... |
| Description |
OptiMOS Chip data sheet
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| File Size |
89.25K /
5 Page |
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it Online |
Download Datasheet |
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INFINEON[Infineon Technologies AG]
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| Part No. |
SLE66C84PE SLE66C84PEM5 SLE66C84PEC
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| OCR Text |
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SLE 66C84PE C
Die (sawn, unsawn) M5.1
1.8 V; 3.0 V; 5.0 V or 3.0 V; 5.0 V
- 25C to + 70C or - 25C to + 85C Up to 33 MHz
or 1 MHz - 7.5 MHz
SLE 66C84PE M5
For ordering information please refer to the databook and contac... |
| Description |
Security & Chip Card ICs
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| File Size |
59.21K /
8 Page |
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it Online |
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ST
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| Part No. |
ST16ST2G
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| OCR Text |
...ST2G can be delivered either in unsawn or sawn wafers, 180 or 275 micron thickness as well as in micromodule package. For ordering information and request for quotation (RTQ) please contact your nearest ST sales office.
Figure 1. Block D... |
| Description |
Smartcard MCU With up to 16352 Bytes EEPROM & T2G Authentication Library
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| File Size |
21.72K /
2 Page |
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it Online |
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Price and Availability
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