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Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
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| Part No. |
C7041 C7040
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| OCR Text |
...thinned CCD area image sensor)
thinning
22
23
21
20
15
14
13
2 BEVEL
V
1
2
12
11
V=58, 122, 250 H=512, 1024
3
4
5
8
9
10
4 BLANK
2 SIGNAL OUT
n
4 BLANK
6 BEVEL
6 BEV... |
| Description |
CCD multichannel detector head
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| File Size |
205.06K /
6 Page |
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it Online |
Download Datasheet
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HAMAMATSU[Hamamatsu Corporation]
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| Part No. |
C7973
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| OCR Text |
...DB0037EA
I Device structure
thinning
SS 13
P1V P2V 11 10
4 BEVEL
N 4 3 2 1234 M
RG 1 RD 12 OD 3
4 BEVEL
2 14 4 OS OG SG 4 BLANK
65 P1H P2H BEVEL ACTIVE PIXEL BEVEL TOTAL PIXEL 4 BLANK
TOTAL PIXEL
KMPDC0134EA
THI... |
| Description |
CCD multichannel detector head
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| File Size |
193.07K /
7 Page |
View
it Online |
Download Datasheet |
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STATSCHIP[STATS ChipPAC, Ltd.]
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| Part No. |
FBGA-SD
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| OCR Text |
...standard package outlines * Die thinning to 75um (3mils) capability * Low loop wire bonding; reverse and die to die * Up to 2mm die overhang per side * Halogen-free and Low-K wafer compatible BOM * Ball counts up to 450 balls
DESCRIPTION... |
| Description |
Fine Pitch Ball Grid Array - Stacked Die
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| File Size |
555.83K /
2 Page |
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it Online |
Download Datasheet |
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STATSCHIP[STATS ChipPAC, Ltd.]
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| Part No. |
FLGA-SD
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| OCR Text |
...standard package outlines * Die thinning to 75um (3mils) capability * Low loop wire bonding; reverse and die to die * Up to 2mm die overhang per side * Halogen-free and Low-K wafer compatible BOM
DESCRIPTION
STATS ChipPAC's chip stack t... |
| Description |
Fine Pitch Land Grid Array - Stacked Die
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| File Size |
533.77K /
2 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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