PM-8083 pdf Datasheet P4 Part Num --- IC-ON-LINE


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PM-8083 Datasheet PDF File

For PM-8083 Found Datasheets File :: 73+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 |

					SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Electronic
Part No.	K4S280832D-TC_L1H K4S280832D-TC_L1L K4S280832D-TC_L75 K4S280832D-TC_L7C K4S280832D K4S280832D-TC/L1H K4S280832D-TC/L1L K4S280832D-TC/L75 K4S280832D-TC/L7C
Description	RES, 0603, TF, 16.5R, 1%, 1/10W 128Mbit SDRAM (4M x 8Bit x 4 Banks Synchronous DRAM)
File Size	109.67K / 11 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-808361650LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					AMPHENOL CORP
Part No.	G8083293 G8081293 G8084031 G8084032
Description	29 CONTACT(S), FEMALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER, SOCKET 29 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET 6 CONTACT(S), FEMALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER, SOCKET
File Size	1,350.18K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10144518-083802LF
Description	BergStak® Lite 0.80mm, Board-to-Board Connector, 80 Positions, Dual Row, Vertical Header.
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor]
Part No.	K4H280838F-TC_LB3 K4H280438F K4H280438F-TC_LA0 K4H280438F-TC_LA2 K4H280438F-TC_LB0 K4H280838F-TC_LA2 K4H280838F-TC_LB0
Description	128Mb F-die DDR SDRAM Specification
File Size	203.97K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-808301350LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Renesas Electronics Corporation
Part No.	H8/38083R H8/38086RF
Description	Renesas 16-Bit Single-Chip Microcomputer H8 Family/H8/300H Super Low Power Series
File Size	4,146.92K / 697 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-808361300LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung semiconductor
Part No.	K4S281632K-UC_L50 K4S281632K-UC_L60 K4S280832K-UC_L75 K4S281632K-UC/L50 K4S281632K-UC/L60 K4S280832K-UC/L75 K4S281632K-UC/L75
Description	128Mb K-die SDRAM Specification
File Size	237.10K / 15 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-808361500LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4H280438F-TC/LA0 K4H280838F-TC/LA2 K4H280838F-TC/LB3 K4H280438F-TC/LA2 K4H280838F-TC/LB0 K4H280438F-TC/LB0
Description	128Mb F-die DDR SDRAM Specification 128Mb的的F - DDR SDRAM内存芯片规格 RESISTOR, 2M OHM, 0.063W, 1%
File Size	208.51K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G832MC010808322HR
Description	0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 18.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold Black.
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor] SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
Part No.	K4S280832B-TL80 K4S280832B K4S280832B-TC10 K4S280832B-TC1H K4S280832B-TC1L K4S280832B-TC75 K4S280832B-TCL10 K4S280832B-TCL1H K4S280832B-TCL1L K4S280832B-TCL75 K4S280832B-TCL80 K4S280832B-TL10 K4S280832B-TL1H K4S280832B-TL1L K4S280832B-TL75 K4S280832B-TC80
Description	4M x 8Bit x 4 Banks Sychronous DRAM 4米8位4银行Sychronous内存
File Size	120.23K / 10 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G832MC030808322HR
Description	0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 18.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold White.
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor]
Part No.	K4H280838F-ULB3 K4H280438F-UC K4H280438F-UCA0 K4H280438F-UCA2 K4H280438F-UCB0 K4H280438F-ULA0 K4H280438F-ULA2 K4H280438F-ULB0 K4H280838F-UCA2 K4H280838F-UCB0 K4H280838F-UCB3 K4H280838F-ULA2 K4H280838F-ULB0
Description	128Mb F-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)
File Size	295.20K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G80830022DHR
Description	PCB Socket 2.54mm Pitch Rightangle DIP, 1x2Pin, 15u\\ Gold, NY6T, TAIL=3.2mm, TUBE
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
Part No.	K4H280438F-ULA2 K4H280838F-UCB3 K4H280838F-ULB3 K4H280438F-UCA2 K4H280838F-UCA2 K4H280438F-UCB0 K4H280438F-UCA0 K4H280838F-UCB0 K4H280438F-ULA0 K4H280838F-ULB0 K4H280438F-UCB00
Description	128Mb F-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) 128Mb的的F -模与铅DDR SDRAM的规6 TSOP-II免费（符合RoHS
File Size	299.74K / 23 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	UCC28083D
Description	Current Mode Push-Pull PWM With Programmable Slope Compensation 8-SOIC -40 to 85
Tech specs			Get Free Sample	Official Product Page

					Samsung Electronic
Part No.	M374F08083DJ3-CEDOMODE
Description	8M x 72 DRAM DIMM with ECC Using 8M x 8, 8K & 4K Refresh, 3.3V Data Sheet
File Size	458.47K / 20 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	UCC38083D
Description	Current Mode Push-Pull PWM With Programmable Slope Compensation 8-SOIC 0 to 70
Tech specs			Get Free Sample	Official Product Page

For PM-8083 Found Datasheets File :: 73+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 |

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