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For layer-iii Found Datasheets File :: 1158 Search Time::9.391ms
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				Atmel Corp. ATMEL[ATMEL Corporation]
Part No.	AT77C101B
OCR Text	Layer Over a 0.8 m CMOS Array Image Zone: 0.4 x 14 mm = 0.02" x 0.55" Image Array: 8 x 280 = 2240 pixels Pixel Pitch: 50 m x 50 m = 500 dpi ...III IV V VI D 100% production tested at +25C 100% production tested at +25C, and sample tested at sp...
Description	Thermal Fingerprint Sensor with Sensing Area and Digital Output Thermal Fingerprint Sensor with 0.4 mm X 14 mm (0.02" x 0.55") sensing area and digital output (on-chip ADC)
File Size	267.85K / 21 Page	View it Online	Download Datasheet

				SANYO[Sanyo Semicon Device]
Part No.	LC89210
OCR Text	...owing few recommendations. 1. 4-layer boards The digital and analog system grounds should be separated and then connected at a single point (single-point ground). Furthermore, the location of the single-point ground should be as close to th...
Description	High-speed fax modem data pump
File Size	197.49K / 10 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC Electronic Theatre Controls, Inc.
Part No.	RMPA0913C-58
OCR Text	...er.6, 4/28/98 Board Type: Multi Layer FR4 Signal to Ground Separation: 0.016" Characteristic performance data and specifications are subject to change without notice. www.raytheon.com/micro Revised March 30, 2000 Page 3 Raytheon RF Compo...
Description	3.5V AMPS/CDMA Power Amplifier
File Size	254.72K / 6 Page	View it Online	Download Datasheet

				STMICROELECTRONICS[STMicroelectronics]
Part No.	STA015 STA015B STA015T
OCR Text	LAYER III AUDIO DECODER WITH ADPCM CAPABILITY PRODUCT PREVIEW SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: - All features specified for Layer III in ISO/IEC 11172-3 (MPEG 1 Audio) - All features specified for Layer III in ISO/IEC 13818...
Description	MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY
File Size	274.89K / 44 Page	View it Online	Download Datasheet

				Motorola
Part No.	MCF5272
OCR Text	...n Systems Interconnection (OSI) Layer 2 protocol commonly used in data communications systems. Many other common layer 2 protocols, for exam...III, "Profiling Test 3.1, "Test Setup" 3.2, "HDLC Profiling Test Description" 3.3, "Standard Perform...
Description	Users Guide
File Size	113.56K / 28 Page	View it Online	Download Datasheet

				Intel
Part No.	GD82551ER
OCR Text	............4 10/100 Mbps Physical Layer Unit.......................................................................... 4 3.0 Performance Enhancements..........................................................................................
Description	IC,LAN NODE CONTROLLER,BGA,196PIN
File Size	539.30K / 94 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc] MOTOROLA[Motorola Inc]
Part No.	MCM64PC64S MCM64PC64SG66 MCM64PC32 MCM64PC32SG66
OCR Text	...t Static RAM High Quality Multi-Layer FR4 PWB with Separate Power and Ground Planes Single 3.3 V +10%, - 5% Power Supply Burndy Connector, Part Number: CELP2X80SC3Z48 Intel COAST 3.0 Option III Compliant Burst Order Select (BOSEL) Option ...
Description	256K/512K Pipelined BurstRAM Secondary Cache Module for Pentium
File Size	180.47K / 16 Page	View it Online	Download Datasheet

				Samsung semiconductor
Part No.	S5L9276 S5L9276X01
OCR Text	Layer III audio decoder, capable of decoding compressed elementary bit stream as specified in ISO/IEC standard. As a decoder for the DISC-MAN, it can provide you more small and cheaper solution for MP3 player application. S5L9276 is low vol...
Description	OPTICAL CD MP3 SYSTEM Stereo/Audio IC
File Size	182.00K / 50 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	XPC850CZT50BU XPC850CZT66BU XPC850DECZT50BU XPC850DECZT66BU XPC850DEZT50BU XPC850DEZT66BU XPC850DEZT80BU XPC850DSLCZT50BU XPC850DSLZT50BU XPC850SRCZT50BU XPC850SRCZT66BU XPC850SRZT50BU XPC850SRZT66BU XPC850SRZT80BU XPC850ZT50BU XPC850ZT66BU XPC850ZT80BU XPC850CZT80B XPC850DECZT80B XPC850SRCZT80B
OCR Text	...natural convection and a single layer board (no thermal vias). 3 Assumes natural convection, a multilayer board with thermal vias4, 1 watt MPC850 dissipation, and a board temperature rise of 20C above ambient. 4 Assumes natural convection, ...
Description	Communications Controller Hardware Specifications Microprocessor
File Size	392.99K / 76 Page	View it Online	Download Datasheet

For layer-iii Found Datasheets File :: 1158 Search Time::9.391ms
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