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heating cooling Datasheet PDF File

For heating cooling Found Datasheets File :: 2763 Search Time::1.454ms
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				Seoul Semicondutctor, Inc. SEOUL[Seoul Semiconductor] http://
Part No.	SSC-YGHR411-H
OCR Text	...le (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface...cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead Free Solder -Preliminary heating ...
Description	CHIP LED DEVICE DUAL COLOR LED, RED/YELLOW GREEN, 1.5 mm
File Size	425.68K / 7 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc]
Part No.	MMQA5V6T1 MMQA20VT1 ON2242
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * Soldering a device wi...cooling should be used since the use of forced cooling will increase the temperature gradient and wi...
Description	SC-59 QUAD TRANSIENT VOLTAGE SUPPRESSOR 5.6 VOLTS 24 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE From old datasheet system
File Size	136.87K / 8 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. Motorola, Inc. MOTOROLA[Motorola Inc] ONSEMI[ON Semiconductor]
Part No.	MSB709RT1 MSB709-RT1 ON2370
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description	PNP General Purpose Amplifier Transistor Surface Mount 100 mA, 25 V, PNP, Si, SMALL SIGNAL TRANSISTOR From old datasheet system
File Size	111.84K / 4 Page	View it Online	Download Datasheet

				Seoul Semicondutctor, Inc. SEOUL[Seoul Semiconductor]
Part No.	SSC-YGFR411-H
OCR Text	...le (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface...cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead Free Solder -Preliminary heating ...
Description	CHIP LED DEVICE DUAL COLOR LED, RED/YELLOW GREEN, 1.5 mm
File Size	400.92K / 7 Page	View it Online	Download Datasheet

				http:// SEOUL[Seoul Semiconductor]
Part No.	SSC-YG104
OCR Text	... (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface...cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder -Preliminary heating ...
Description	CHIP LED DEVICE
File Size	313.04K / 7 Page	View it Online	Download Datasheet

				Seoul Semicondutctor Inc. SEOUL[Seoul Semiconductor]
Part No.	SSC-YG104-IC1
OCR Text	...onditions / Profile Preliminary heating to be at 150max. for 2 minutes max. Soldering heat to be at 220max. for 5 seconds max. LED Surface ...cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Reflow Soldering Conditions /Lead-Free...
Description	CHIP LED DEVICE
File Size	313.59K / 7 Page	View it Online	Download Datasheet

				http:// SEOUL[Seoul Semiconductor]
Part No.	SSC-YG101
OCR Text	... (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface...cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder -Preliminary heating ...
Description	CHIP LED DEVICE
File Size	314.52K / 7 Page	View it Online	Download Datasheet

				Seoul Semicondutctor, Inc. Seoul Semicondutctor Inc. SEOUL[Seoul Semiconductor]
Part No.	SSC-YG101-IC1
OCR Text	... (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface...cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder -Preliminary heating ...
Description	CHIP LED DEVICE 芯片发光器件
File Size	306.18K / 7 Page	View it Online	Download Datasheet

				Fujitsu Component Limited.
Part No.	FTR-F2AK005T FTR-F2AK024T FTR-H2AK024T FTR-B2NA4.5Z FTR-F2AK009T FTR-H2AK009T FTR-B2NA012Z FTR-B2MA4.5Z FTR-H2AK005T FTR-F2AK006T FTR-H2AK006T FTR-F2AK012T FTR-H2AK012T FTR-B2MA012Z FTR-F2AK048T FTR-H2AK048T FTR-B206
OCR Text	...d, status of parts mounting and heating method. IS C 30sec Max. 0 60secMax. 60secMax. 90secMax. O 4 N n PACKAGING ...cooling Soldering Iron Temperature: maximum360C Duration: maximum3sec. 90~120sec. max.120sec. ...
Description	4 Pole (2 FORM C 2 FORM A) Signal Relay for Central Switching/ Data Transmission
File Size	1,138.66K / 8 Page	View it Online	Download Datasheet

				Seoul Semicondutctor Inc. SEOUL[Seoul Semiconductor]
Part No.	SSC-YE101-IG0
OCR Text	... (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface...cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder -Preliminary heating ...
Description	CHIP LED DEVICE
File Size	384.57K / 7 Page	View it Online	Download Datasheet

For heating cooling Found Datasheets File :: 2763 Search Time::1.454ms
Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |