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LG
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Part No. |
47LM620S 47LM625S
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OCR Text |
........................ 10 screw assembly working guid e .............................................. 18 block diagram .................................................................................. 19 exploded view ............. |
Description |
LED LCD TV Manual
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File Size |
9,038.09K /
119 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGA4022
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OCR Text |
...ld be observed during handling, assembly and test.
7
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 10, 2006
TGA4022
Rec... |
Description |
K-Band High Power Amplifier
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File Size |
103.67K /
9 Page |
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it Online |
Download Datasheet |
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Kersemi Electronic Co., Ltd. Kersemi Electronic Co., Ltd...
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Part No. |
IRF1404L IRF1404S
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OCR Text |
... s embled on ww 02, 2000 in the assembly line "l" assembly lot code int ernational rectifier logo part number dat e code year 0 = 2000 we e k 02 line l www.kersemi.com
irf1404s/l 9 to-262 part marking information to-262 package outlin... |
Description |
HEXFET? Power MOSFET
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File Size |
3,989.19K /
10 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGA4600-EPU
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OCR Text |
...ld be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change ... |
Description |
60 GHz Low-Noise Amplifier 60GHz Low Noise Amplifier
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File Size |
123.48K /
8 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGA4802-EPU
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OCR Text |
...ld be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change ... |
Description |
12.5GB/S IRZ Modulator Driver 12.5Gb/s Modulator Driver Amplifier
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File Size |
160.49K /
10 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGA4805-EPU
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OCR Text |
...
0.1F Voffset Adjust
Chip Assembly and Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
Note: Devices designated ... |
Description |
10GB/s Differential Transimpedance Amplifier 10 GB/s Differential Transimpedance Amplifier
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File Size |
206.34K /
6 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGA4811
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OCR Text |
...une 30, 2005
TGA4811
Chip Assembly Diagram
Vg2
Vd
0.1uF
100pF
1800pF RF OUT
RF IN
1800pF
0.1uF
Vg1
3 (Three) 0.7 mil chisel bond wires at RF IN and RF OUT or 1 (one) 3 mil ribbon at RF IN and RF OUT. Vg2 ... |
Description |
DC - 60 GHz Low Noise Amplifier
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File Size |
367.44K /
9 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGA4815-EPU
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OCR Text |
...Bypass Capacitors Required (see assembly drawing)
TABLE III THERMAL INFORMATION Parameter Test Conditions TCH (oC) RTJC (qC/W) TM (HRS)
V+ = 3.3 V RJC Thermal I+ = 80 mA 80 36.9 5.7 E+7 Resistance (channel to backside of Pdiss = 0.264... |
Description |
10 GB/s Differential Transimpedance Amplifier 10Gb/s Differential TIA
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File Size |
104.13K /
7 Page |
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it Online |
Download Datasheet |
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Price and Availability
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