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CYPRESS SEMICONDUCTOR CORP
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| Part No. |
W170-01GT W170-01GI
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| OCR Text |
...n can be applied to any device (asic, multiple output clock buffer/driver, etc.) which is put into the feedback path. referring to figure 2 , if the traces between the asic/buffer and the destination of the clock signal(s) (a) are equal i... |
| Description |
W170 SERIES, PLL BASED CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO8
Miscellaneous Clock Generator
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| File Size |
104.66K /
6 Page |
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it Online |
Download Datasheet
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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MMA6280QR2 MMA6280Q
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| OCR Text |
...cell) and a signal conditioning asic contained in a single integrated circuit package. The sensing elements are sealed hermetically at the wafer level using a bulk micromachined cap wafer. The g-cell is a mechanical structure formed from se... |
| Description |
【1.5g - 6g Dual Axis Low-g Micromachined Accelerometer
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| File Size |
118.72K /
8 Page |
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it Online |
Download Datasheet |
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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MMA6270QT MMA6270QR2
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| OCR Text |
...cell) and a signal conditioning asic contained in a single integrated circuit package. The sensing elements are sealed hermetically at the wafer level using a bulk micromachined cap wafer. The g-cell is a mechanical structure formed from se... |
| Description |
±1.5 g - 6 g Dual Axis Low-g Micromachined Accelerometer
【1.5 g - 6 g Dual Axis Low-g Micromachined Accelerometer
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| File Size |
273.80K /
11 Page |
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it Online |
Download Datasheet |
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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MMA6270QT_07 MMA6270QR2 MMA6270QT MMA6270QT07
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| OCR Text |
...cell) and a signal conditioning asic contained in a single integrated circuit package. The sensing elements are sealed hermetically at the wafer level using a bulk micromachined cap wafer. The g-cell is a mechanical structure formed from se... |
| Description |
±1.5 g - 6 g Dual Axis Low-g Micromachined Accelerometer
【1.5 g - 6 g Dual Axis Low-g Micromachined Accelerometer
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| File Size |
312.51K /
12 Page |
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it Online |
Download Datasheet |
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FREESCALE[Freescale Semiconductor, Inc]
Freescale Semiconductor, In...
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| Part No. |
MMA3202_06 MMA3202 MMA3202D MMA3202DR2 MMA3202EG MMA3202EGR2 MMA320206
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| OCR Text |
... and a CMOS signal conditioning asic contained in a single integrated circuit package. The sensing element is sealed hermetically at the wafer level using a bulk micromachined "cap'' wafer. The g-cell is a mechanical structure formed from s... |
| Description |
Surface Mount Micromachined Accelerometer
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| File Size |
236.64K /
10 Page |
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it Online |
Download Datasheet |
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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MMA3201EGR2 MMA3201 MMA3201D MMA3201DR2 MMA3201EG
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| OCR Text |
... and a CMOS signal conditioning asic contained in a single integrated circuit package. The sensing element is sealed hermetically at the wafer level using a bulk micromachined "cap'' wafer. The g-cell is a mechanical structure formed from s... |
| Description |
Surface Mount Micromachined Accelerometer
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| File Size |
259.59K /
10 Page |
View
it Online |
Download Datasheet |
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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MMA2301EGR2 MMA2301 MMA2301D MMA2301DR2 MMA2301EG
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| OCR Text |
... and a CMOS signal conditioning asic contained in a single integrated circuit package. The sensing element is sealed hermetically at the wafer level using a bulk micromachined cap wafer. The g-cell is a mechanical structure formed from semi... |
| Description |
Surface Mount Micromachined Accelerometer
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| File Size |
263.50K /
10 Page |
View
it Online |
Download Datasheet |
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