Part Number Hot Search : 
04D66BDR AK4396V DM330012 SA532N 2SA1036K 0505Y D31010C 2106A
Product Description
Full Text Search
  adhesive Datasheet PDF File

For adhesive Found Datasheets File :: 5056    Search Time::1.641ms    
Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    LSE2041-TRF-X LSE2041_TRF-X LSE2041/TRF-X

LIGITEK electronics co., ltd.
Part No. LSE2041-TRF-X LSE2041_TRF-X LSE2041/TRF-X
OCR Text ...ge Thickness Feed Hole Location adhesive Tape Width adhesive Tape Position Tape Width ------------------------------------------------------------- H1 20.2 17.125 20.0 26.0 24.0 21.0 H2 L P P1 P2 T W0 W1 W2 W3 ------- W0 12....
Description TAPE AND REEL TYPE LED LAMPS

File Size 119.23K  /  7 Page

View it Online

Download Datasheet





    LSRF2641-TRF-X LSRF2641_TRF-X LSRF2641/TRF-X

LIGITEK electronics co., ltd.
Part No. LSRF2641-TRF-X LSRF2641_TRF-X LSRF2641/TRF-X
OCR Text ...ge Thickness Feed Hole Location adhesive Tape Width adhesive Tape Position Tape Width ------------------------------------------------------------- H1 20.2 17.125 20.0 26.0 24.0 21.0 H2 L P P1 P2 T W0 W1 W2 W3 ------- W0 12....
Description TAPE AND REEL TYPE LED LAMPS

File Size 118.49K  /  7 Page

View it Online

Download Datasheet

    2N5551 2N5551TA

Fairchild Semiconductor, Corp.
Part No. 2N5551 2N5551TA
OCR Text ....0 FIRST WIRE OFF IS COLLECTOR adhesive TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON TOP FIRST WIRE OFF IS EMITTER adhesive TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON BOTTOM ORDER STYLE D74Z (M) ORDER STYLE D75Z (P) FIRS...
Description NPN General Purpose Amplifier(NPN型通用放大 600 mA, 160 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92

File Size 498.83K  /  12 Page

View it Online

Download Datasheet

    LSRF42241-TRF-X LSRF42241_TRF-X LSRF42241/TRF-X

LIGITEK electronics co., ltd.
Part No. LSRF42241-TRF-X LSRF42241_TRF-X LSRF42241/TRF-X
OCR Text ...ge Thickness Feed Hole Location adhesive Tape Width adhesive Tape Position Tape Width ------------------------------------------------------------- H1 20.2 17.125 20.0 26.0 24.0 21.0 H2 L P P1 P2 T W0 W1 W2 W3 ------- W0 12....
Description TAPE AND REEL TYPE LED LAMPS

File Size 117.61K  /  7 Page

View it Online

Download Datasheet

    MT6224-OG-A

Marktech Corporate
Part No. MT6224-OG-A
OCR Text ...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description 5.0mm ROUND BI- POLAR LAMP (3LEADS)

File Size 131.79K  /  6 Page

View it Online

Download Datasheet

    LSRF2041-PF-TBF-X LSRF2041-PF_TBF-X LSRF2041-PF/TBF-X

LIGITEK electronics co., ltd.
Part No. LSRF2041-PF-TBF-X LSRF2041-PF_TBF-X LSRF2041-PF/TBF-X
OCR Text ...ge Thickness Feed Hole Location adhesive Tape Width adhesive Tape Position Tape Width ------------------------------------------------------------- H2 L P P1 P2 T W0 W1 W2 W3 ------- W0 12.4 3.15 5.1 ------- 0.49 0.12 0.2 -...
Description TAPE AND BOX TYPE LED LAMPS

File Size 130.27K  /  8 Page

View it Online

Download Datasheet

    MT4164S4-HR6-2-A

Marktech Corporate
Part No. MT4164S4-HR6-2-A
OCR Text ...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description 4.8mm ROUND LED LAMP WITH HOLDER

File Size 136.43K  /  5 Page

View it Online

Download Datasheet

    TDA8725T

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TDA8725T
OCR Text ...must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and max...
Description Antenna signal processor

File Size 97.54K  /  10 Page

View it Online

Download Datasheet

    MT430-G-A

Marktech Corporate
Part No. MT430-G-A
OCR Text ...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description 4.9mm ROUND LED LAMP

File Size 127.41K  /  6 Page

View it Online

Download Datasheet

    MT430-Y-A

Marktech Corporate
Part No. MT430-Y-A
OCR Text ...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description 4.9mm ROUND LED LAMP

File Size 127.42K  /  6 Page

View it Online

Download Datasheet

For adhesive Found Datasheets File :: 5056    Search Time::1.641ms    
Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

▲Up To Search▲

 




Price and Availability




 
Price & Availability of adhesive

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
1.1268591880798