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Amphenol Communications Solutions |
| Part No. |
67998-228HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10123982-201
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| Description |
MEG-Array®, Mezzanine, 320 Positions, Receptacle, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10123982-291
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| Description |
MEG-Array®, Mezzanine, 320 Positions, Receptacle, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67998-220HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10123982-201LF
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| Description |
MEG-Array®, Mezzanine, 320 Positions, Receptacle, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67998-226HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67998-222HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail
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Official Product Page
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Toshiba, Corp.
Electronic Theatre Controls, Inc.
ITT, Corp.
ATM Electronic, Corp.
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| Part No. |
AM29824DM AM29826DM AM29822DM AM29822LMB AM29822DMB AM29826PCB AM29826XC
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| Description |
9-Bit D-Type Flip-Flop
Reference Design kit for the iP1206 a 300kHz, 30A Synchronous Buck Converter; A IRDCIP1206-B with Standard Packaging
Intelligent Power Module. Gate Driver IC integrated with a half bridge FredFET Designed for sub 250W Motor Drive applications in a 9-Lead SIP. RDSon of 1.0 Ohm; A IR3101 with Standard Packaging 10位D型触发器
IR1150 Demo Board designed for use in continuous conduction mode boost converter applications for power factor correction and harmonic current reduction.; A IRAC1150-300W with Standard Packaging 10位D型触发器
Octal D-Type Flip-Flop 八路D类触发器
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| File Size |
228.72K /
8 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10125756-982200LF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x8, 98 Positions, 1.00mm (0.039in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51939-822LF
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| Description |
PwrBlade®, Power Connectors, 3ACP 4P 24S Right Angle Header, Solder To Board
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67998-224HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail
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Official Product Page
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Bom2Buy.com
Price and Availability
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