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  8237-6004 Datasheet PDF File

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    82378ZB 82379AB

Intel Corporation
Part No. 82378ZB 82379AB
Description    SYSTEM I/O APIC(SIO.A) AND
File Size 1,073.09K  /  137 Page

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Amphenol Communications Solutions
Part No. 10082378-10202TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPT-18-6004
Description Temperature Compensated Amplifier 6 GHz - 18 GHz
File Size 883.58K  /  2 Page

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Amphenol Communications Solutions
Part No. 10082378-11003TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    CGM-18-6004

Teledyne Technologies Incorporated
Part No. CGM-18-6004
Description Module Amplifier 6 GHz - 18 GHz
File Size 903.33K  /  2 Page

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Amphenol Communications Solutions
Part No. 10082378-10013TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPT-13-6004
Description Temperature Compensated Amplifier 6 GHz - 13 GHz
File Size 883.56K  /  2 Page

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Amphenol Communications Solutions
Part No. 88237-014LF
Description PV® Wire-to-Board Connector System, Mini Latch Housing, Double Row, Polarized, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    TGM-18-6004

Teledyne Technologies Incorporated
Part No. TGM-18-6004
Description Module Amplifier 6 GHz - 18 GHz
File Size 891.16K  /  2 Page

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Amphenol Communications Solutions
Part No. 88237-060LF
Description PV® Wire-to-Board Connector System, Mini Latch Housing, Double Row, Polarized, 60 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Teledyne Technologies Incorporated.
TELEDYNE[Teledyne Technologies Incorporated]
Part No. TLA-18-6004
Description Low Noise Amplifier 6 GHz - 18 GHz
File Size 889.51K  /  2 Page

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Amphenol Communications Solutions
Part No. 10082378-10000TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    Teledyne Technologies Incorporated.
TELEDYNE[Teledyne Technologies Incorporated]
Part No. CLA-18-6004
Description Low Noise Amplifier 6 GHz - 18 GHz
File Size 889.48K  /  2 Page

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Amphenol Communications Solutions
Part No. 10082378-10112TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CLT-18-6004
Description Temperature Compensated Amplifier 6 GHz - 18 GHz
File Size 885.37K  /  2 Page

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Amphenol Communications Solutions
Part No. 10082378-10101TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x4, 64 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    UPD8237A UPD8237AC UPD8237AC-5

NEC
Part No. UPD8237A UPD8237AC UPD8237AC-5
Description HIGH-PERFORMANCE PROGRAMMABLE DMA CONTROLLER
File Size 971.69K  /  17 Page

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Amphenol Communications Solutions
Part No. 10082378-11001TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x4, 64 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    Intel
Part No. 82371AB FW82371AB
Description PCI-TO-ISA / IDE XCELERATOR (PIIX4)
File Size 1,037.03K  /  284 Page

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Amphenol Communications Solutions
Part No. 48237-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

Official Product Page

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