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  74058-1011 Datasheet PDF File

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    74058-2517 0740582517

Molex Electronics Ltd.
Part No. 74058-2517 0740582517
Description 2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row, PinEnd Version, 150 Circuits, Pin Length 6.25mm (.246)
File Size 366.07K  /  4 Page

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Rochester Electronics LLC
Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs 　 　

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HUA FENG CIRCUIT





    74058-2512 0740582512

Molex Electronics Ltd.
Part No. 74058-2512 0740582512
Description 2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row, PinEnd Version, 150 Circuits, Pin Length 6.25mm (.246)
File Size 298.27K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

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    74058-2521 0740582521

Molex Electronics Ltd.
Part No. 74058-2521 0740582521
Description 2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row, PinEnd Version, 150 Circuits, Pin Length 4.75mm (.187)
File Size 204.53K  /  3 Page

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Amphenol Communications Solutions
Part No. 10118085-101-10LF
Description Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

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    0740581024 SD-74058-002 74058-1024

Molex Electronics Ltd.
Part No. 0740581024 SD-74058-002 74058-1024
Description 2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header
File Size 326.50K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114831-10112LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 12 POSITIONS, TIN PLATING
Tech specs 　 　

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    03-09-1011

Molex Electronics Ltd.
Part No. 03-09-1011
Description 2.36mm Diameter Standard
File Size 30.58K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114829-10113LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions
Tech specs 　 　

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Part No. 60-1011
Description MAINS DIST BOARD SEQUEN.STA
File Size 33.44K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114828-10113LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions
Tech specs 　 　

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    EM-1011

Asahi Kasei Microsystems
Part No. EM-1011
Description EM-1011 is ultra-small Hall effect ICs of a single silicon chip composed of Hall element and a signal processing IC
File Size 129.12K  /  3 Page

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Amphenol Communications Solutions
Part No. 10114830-10113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs 　 　

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    MULTI CONTACT AG
Part No. 23.1011-23
Description INTERCONNECTION DEVICE
File Size 163.40K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114831-10111LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 11 POSITIONS, TIN PLATING
Tech specs 　 　

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    03-06-1011-P

Molex Electronics Ltd.
Part No. 03-06-1011-P
Description PLUG & RECEPTACLE HOUSINGS I CIRCUIT
File Size 113.41K  /  3 Page

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Amphenol Communications Solutions
Part No. 10114830-10112LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 12 Positions
Tech specs 　 　

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Part No. 1011
Description PULSE TRANSFORMER FOR GENERAL PURPOSE APPLICATION(S)
File Size 1,055.75K  /  8 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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