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  5716-3CC Datasheet PDF File

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    BAV23 BAV23CA BAV23CC

SEMTECH ELECTRONICS LTD.
Part No. BAV23 BAV23CA BAV23CC
Description SURFACE MOUNT SWITCHING DIODES
File Size 176.54K  /  2 Page

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Amphenol Communications Solutions
Part No. 79257-164HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    FHN4-6426 FHN4-7819 FHN4-8526 FPN4-5716 FPN5-4818 FHN6-8526 FPN7-6516

http://
Riedon Powertron
Part No. FHN4-6426 FHN4-7819 FHN4-8526 FPN4-5716 FPN5-4818 FHN6-8526 FPN7-6516
Description FPN FHN Networks Precision Shunt Networks
File Size 405.72K  /  5 Page

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Amphenol Communications Solutions
Part No. 85716-105LF
Description Metral® Board Connectors, Backplane Connectors, Signal Header, Vertical, Press Fit, 4 Rows, 192 Positions.
Tech specs 　 　

Official Product Page

    Advanced Micro Devices, Inc.
Part No. AM9513CC
Description System Timing Controller Advanced MOS/LSI
File Size 6,048.14K  /  26 Page

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Amphenol Communications Solutions
Part No. 85716-205LF
Description Metral® Board Connectors, Backplane Connectors, Signal Header, Vertical, Press Fit, 4 Rows, 192 Positions.
Tech specs 　 　

Official Product Page

    Zarlink Semiconductor Inc.
Part No. SL523 SL523CCM
Description 100MHz DUAL WIDEBAND LOG AMPLIFIER
File Size 357.59K  /  9 Page

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Amphenol Communications Solutions
Part No. 69157-166HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    BB503CCS-TL-E

Renesas Electronics Corporation
Part No. BB503CCS-TL-E
Description Built in Biasing Circuit MOS FET IC UHF RF Amplifier
File Size 211.62K  /  11 Page

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Amphenol Communications Solutions
Part No. 79257-162HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    OKI SEMICONDUCTOR CO., LTD.
Part No. MSM5716C50
Description 2M×8 Dynamic RAM(2M×8动态RAM) 200万8动态RAM米8动态内存）
File Size 619.27K  /  45 Page

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Amphenol Communications Solutions
Part No. 79257-160HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    OKI
Part No. MSM5716C50
Description (MSM5716C50 / MSM5718C50 / MSM5764802) 16M / 18M / 64M Concurrent RDRAM
File Size 3,187.14K  /  45 Page

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Amphenol Communications Solutions
Part No. 85716-141
Description Metral® Board Connectors, Backplane Connectors, Signal Header, Vertical, Press Fit, 4 Rows, 192 Positions.
Tech specs 　 　

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4R571669D
Description 256/288Mbit RDRAM(D-die)
File Size 313.24K  /  20 Page

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Amphenol Communications Solutions
Part No. 79257-168HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0357160110 35716-0110

Molex Electronics Ltd.
Part No. 0357160110 35716-0110
Description 2.36mm (.093) Diameter Pin Wire-to-Board Terminal, Female, Brass, Wire Range 20-24 AWG (0.52-0.20mm2), Pre-Tin Plated
File Size 86.59K  /  2 Page

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Amphenol Communications Solutions
Part No. 79257-166HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    IRHMK57160

International Rectifier
Part No. IRHMK57160
Description 100V 100kRad Hi-Rel Single N-Channel TID Hardened MOSFET in a TO-254AA Tabless package
File Size 179.20K  /  8 Page

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Amphenol Communications Solutions
Part No. 69157-164HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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