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Molex Electronics Ltd.
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| Part No. |
14-44-2909 A-70475-1303
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| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 9 Circuits 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 9 Circuits
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| File Size |
141.38K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
130-3142-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3142-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3162-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3182-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, APP.
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| Tech specs |
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Official Product Page
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FAIRCHILD[Fairchild Semiconductor] Fairchild Semiconductor Corporation
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| Part No. |
RMPA39100
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| Description |
37 - 40 GHz 1 Watt Power Amplifier MMIC 37-40 GHz 1 Watt Power Amplifier MMIC DIODE SWITCHING DUAL-DUAL SERIES 240V 225mA-Io 350mW 50ns-trr SOT-26 3K/REEL
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| File Size |
464.86K /
10 Page |
View
it Online |
Download Datasheet
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| |
|
 |
Amphenol Communications Solutions |
| Part No. |
130-3162-11H
|
| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3142-15H
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| Description |
Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, APP
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3182-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, Nickel Sulfamate.
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| Tech specs |
|
|
|
Official Product Page
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|
 |
Amphenol Communications Solutions |
| Part No. |
130-3142-15D
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| Description |
Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, NiS
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| Tech specs |
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Official Product Page
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 |
Amphenol Communications Solutions |
| Part No. |
130-3182-15H
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| Description |
Paladin Plus 3-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
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| Tech specs |
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Official Product Page
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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| Part No. |
BA01303
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| Description |
Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module
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| File Size |
84.26K /
3 Page |
View
it Online |
Download Datasheet
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|
 |
Amphenol Communications Solutions |
| Part No. |
130-3162-15D
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| Description |
Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
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| Tech specs |
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Official Product Page
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