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  256mb m-die mlc nor Datasheet PDF File

For 256mb m-die mlc nor Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. M390S6453ET1-C7A M390S2858ET1-C7A M390S2858ETU M390S2858ETU-C7A M390S3253ET1-C7A M390S3253ETU-C7A M390S6450ET1-C7A M390S6450ETU-C7A
Description 168pin Registered Module based on 256mb E-die with 72-bit ECC

File Size 659.33K  /  26 Page

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    Samsung Electronic
Part No. MR18R16224/8/GAF0
Description (16Mx16)*2(4/8/16)pcs RIMMModule based on 256mb A-die Data Sheet

File Size 410.75K  /  16 Page

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Part No. 1PK-3003D5 1PK-3003D15 1PK-3003D12 1PK-3003D10 1PK-3003D7 1PK-3003D3 1PK-3003D13 1PK-3003D6
Description DIE SET RG 58 RG 174
DIE SET RG 58 RG 59
DIE SET RG 59 RG 6
DIE SET RG 174 MINI RG 59
DIE SET INSULATED 板牙套装绝缘
DIE SET COAX CP88 CP89 板牙套装同轴CP88 CP89
DIE SET RJ11 DEC MMJ 板牙套装RJ112月MMJ
DIE SET N SERIES 板牙套装N系列

File Size 76.50K  /  1 Page

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    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-ULB3 K4H560438E-UC K4H560438E-UC_LA2 K4H560438E-UC_LAA K4H560438E-UC_LB0 K4H560438E-UC_LB3 K4H560438E-UCA2 K4H560438E-UCAA K4H560438E-UCB0 K4H560438E-UCB3 K4H560438E-ULA2 K4H560438E-ULAA K4H560438E-ULB0 K4H560438E-ULB3 K4H560838E-UC_LA2 K4H560838E-UC_LAA K4H560838E-UC_LB0 K4H560838E-UC_LB3 K4H560838E-UCA2 K4H560838E-UCAA K4H560838E-UCB0 K4H560838E-UCB3 K4H560838E-ULA2 K4H560838E-ULAA K4H560838E-ULB0
Description 256mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)

File Size 294.24K  /  23 Page

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    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-ZLB3 K4H560438E-ZC K4H560438E-ZC_LA2 K4H560438E-ZC_LB0 K4H560438E-ZC_LB3 K4H560438E-ZCA2 K4H560438E-ZCB0 K4H560438E-ZCB3 K4H560438E-ZLA2 K4H560438E-ZLB0 K4H560438E-ZLB3 K4H560838E-ZC_LA2 K4H560838E-ZC_LB0 K4H560838E-ZC_LB3 K4H560838E-ZCA2 K4H560838E-ZCB0 K4H560838E-ZCB3 K4H560838E-ZLA2 K4H560838E-ZLB0
Description 256mb E-die DDR SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant)

File Size 355.74K  /  23 Page

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    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-VLB3 K4H560438E-VC K4H560438E-VC_LA2 K4H560438E-VC_LB0 K4H560438E-VC_LB3 K4H560438E-VCA2 K4H560438E-VCB0 K4H560438E-VCB3 K4H560438E-VLA2 K4H560438E-VLB0 K4H560438E-VLB3 K4H560838E-VC_LA2 K4H560838E-VC_LB0 K4H560838E-VC_LB3 K4H560838E-VCA2 K4H560838E-VCB0 K4H560838E-VCB3 K4H560838E-VLA2 K4H560838E-VLB0
Description 256mb E-die DDR SDRAM Specification 54 sTSOP-II with Pb-Free (RoHS compliant)

File Size 294.46K  /  23 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4T56083QF-GCD5 K4T56083QF-ZCD5 K4T56043QF-GCD5 K4T56043QF-ZCD5
Description 256mb F-die DDR2 SDRAM
OSC 3.3V SMT 7X5 CMOS 256mb的的F - DDR2内存芯片

File Size 479.59K  /  27 Page

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    408-8737

Tyco Electronics
Part No. 408-8737
Description The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw

File Size 117.59K  /  2 Page

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    K4H560838E-VC/LB3 K4H560438E-VC/LB3 K4H560438E-VC/LA2 K4H560838E-VC/LA2 K4H560438E-VC/LB0 K4H560838E-VC/LB0 K4H560838E-V

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560838E-VC/LB3 K4H560438E-VC/LB3 K4H560438E-VC/LA2 K4H560838E-VC/LA2 K4H560438E-VC/LB0 K4H560838E-VC/LB0 K4H560838E-VCA2 K4H560438E-VCA2 K4H560438E-VLB3 K4H560838E-VCB3 K4H560438E-VLB0 K4H560438E-VLA2 K4H560438E-VCB3 K4H560838E-VLB0 K4H560838E-VLA2 K4H560838E-VCB0 K4H560438E-VCB0 K4H560838E-VLB3
Description 256mb E-die DDR SDRAM Specification 54 sTSOP-II with Pb-Free (RoHS compliant) 256mb的电子芯片DDR SDRAM内存规格54 sTSOP与铅二无(符合RoHS

File Size 299.00K  /  23 Page

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    Samsung Electronic
Part No. MR18R162CGMN0
Description (16Mx16)*12(16)pcs RIMMModule based on 256mb m-die, 32s banks,16K/32ms Ref, 2.5V Data Sheet

File Size 275.07K  /  14 Page

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