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  1812-223J Datasheet PDF File

For 1812-223J Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    181299-1 181299-4 181299-2 181299-6

Tyco Electronics
Part No. 181299-1 181299-4 181299-2 181299-6
Description AMPMODU I REC. CONTACT, STD.PRESSURE, C.O.S.I.
File Size 79.91K  /  1 Page

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Murata Manufacturing Co Ltd
Part No. GCM32E5C3A223JX0AL
Description Chip Multilayer Ceramic Capacitors for Automotive
Tech specs 　 　

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HUA FENG CIRCUIT





    IMC-181207

Vishay Siliconix
Part No. IMC-181207
Description Surface Mount, Molded Inductor
File Size 84.64K  /  3 Page

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Murata Manufacturing Co Ltd
Part No. GCM32E5C3A223JX0AK
Description Chip Multilayer Ceramic Capacitors for Automotive
Tech specs 　 　

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    1812PS-102JLC 1812PS-103JLB 1812PS-104JLC 1812PS-105JLC 1812PS-122JLB 1812PS-152JLD 1812PS-124JLB 1812PS-153JLD 1812PS-1

Coilcraft lnc.
Part No. 1812PS-102JLC 1812PS-103JLB 1812PS-104JLC 1812PS-105JLC 1812PS-122JLB 1812PS-152JLD 1812PS-124JLB 1812PS-153JLD 1812PS-154JLD 1812PS-223JLC 1812PS-222JLC 1812PS-224JLC 1812PS-272JLB 1812PS-332JLD 1812PS-333JLB
Description Shielded High SRF Inductors 1812PS
File Size 227.90K  /  2 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TLP223J
Description Photorelay (MOSFET output, 1-form-a), 600 V/0.09 A, 5000 Vrms, DIP4
Tech specs 　 　

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    ABRACON CORP
Part No. AISC-1812H-391K
Description 1 ELEMENT, 390 uH, CERAMIC-FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
File Size 508.63K  /  2 Page

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Amphenol Communications Solutions
Part No. 10131319-1812100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 18 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

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Part No. TSC-1812-1UH10 TSC-1812-1UH3
Description 1 ELEMENT, 1 uH, POWDERED IRON-CORE, GENERAL PURPOSE INDUCTOR, SMD
File Size 70.22K  /  1 Page

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Amphenol Communications Solutions
Part No. 10131319-18121G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

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    BOURNS INC
Part No. PM1812-390J
Description 1 ELEMENT, 39 uH, GENERAL PURPOSE INDUCTOR, SMD
File Size 55.80K  /  1 Page

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Amphenol Communications Solutions
Part No. 71918-126LF
Description Quickie® Eject Latch connector, 2.54mm(0.100in), Shrouded Header, Through Hole, Straight, Double Row, 26 Positions
Tech specs 　 　

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    Bourns Electronic Solut...
Part No. PM1812-R22K-RC
Description SMT Chip Inductors
File Size 254.87K  /  4 Page

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Amphenol Communications Solutions
Part No. 77315-118-12LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

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Part No. AO1812 AO1813
Description Peripheral IC
File Size 116.42K  /  1 Page

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Amphenol Communications Solutions
Part No. 91812-312LF
Description Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Top Entry, Double row, 12 Positions, 2.00mm (0.079in) Pitch.
Tech specs 　 　

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    EL2223 EL2223C EL2223J EL2223CJ EL2223L/883B EL2223J/883B

Elantec Semiconductor
Part No. EL2223 EL2223C EL2223J EL2223CJ EL2223L/883B EL2223J/883B
Description 12-Bit, 3.3V, 130MSPS, CommLinkTM High Speed D/A Converter (TSSOP); Temperature Range: -40°C to 85°C; Package: 28-SOIC
Laser Diode Driver with Waveform Generator; Temperature Range: 0°C to 70°C; Package: 28-QFN T&R
12-Bit, 3.3V, 130MSPS, CommLinkTM High Speed D/A Converter (TSSOP); Temperature Range: -40°C to 85°C; Package: 28-TSSOP
High Speed Operational Amplifier
Dual, 500 MHz High Speed, Operational Amplifier
File Size 750.33K  /  10 Page

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Amphenol Communications Solutions
Part No. 91812-116LF
Description Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Top Entry, Double row, 16 Positions, 2.00mm (0.079in) Pitch.
Tech specs 　 　

Official Product Page

    1-1318125-1

Tyco Electronics
Part No. 1-1318125-1
Description Dynamic Series Connectors; V-HDR ASSY 8P FOR SEQUENTIAL T ( AMP )
File Size 182.75K  /  2 Page

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Amphenol Communications Solutions
Part No. 68418-129HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs 　 　

Official Product Page

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