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Samtec, Inc
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| Part No. |
CRIMP-SPECIFICATIONS
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| OCR Text |
...100-08-h 1.26[32mm] lspc-26100-12-h 1.57[40mm] stcp-08-01 0.91[23mm] sctp-12-01 1.06[27mm] sctp-16-01 1.18[30mm] sctp-24-01 1.42[36mm] lspc-30100-05-p5-h 0.79[20mm] lspc-26100-09 1.18[30mm] lspc-26100-08-p5-h 1.18[30mm] lspc-26100-08... |
| Description |
CRIMP/STRIP SPECIFICATIONS
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| File Size |
479.71K /
4 Page |
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Vishay
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| Part No. |
550D
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| OCR Text |
...D277X9006S2 550D337X9006S2 9 11 12 13 15 10 10 10 10 12 0.065 0.060 0.055 0.050 0.045
10 WVDC @ + 85C, SURGE = 13 V . . . 7 WVDC @ + 125C...19mm] maximum from their nominal position when measured from the leading edge of the component lead ... |
| Description |
Solid Tantalum Capacitors, Solid-Electrolyte TANTALEX?, for High Frequency Power Supplies, Hermetically Sealed, Low ESR, Axial Leads
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| File Size |
60.13K /
3 Page |
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMWB33001
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| OCR Text |
...17
Typ -0.2 24 2.0 19 120 15 12 12 1.0
Max 35
Units GHz V dB dB dBm mA % dB dB V
Application Information
CAUTION: THIS IS AN ES...19mm x 1.19mm X 100m. Back of chip is RF and DC Ground.
(c)2004 Fairchild Semiconductor Corporati... |
| Description |
33 GHz Buffer Amplifier MMIC
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| File Size |
228.15K /
6 Page |
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FAIRCHILD[Fairchild Semiconductor] Fairchild Semiconductor Corporation
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| Part No. |
RMPA39100
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| OCR Text |
...utput bonds should be typically 12 mils long corresponding to a typical 2 mil gap between the chip and the substrate material.
DRAIN SUPPLY...19mm x 50m. Back of chip is RF and DC Ground)
(c)2004 Fairchild Semiconductor Corporation RMPA39100... |
| Description |
37 - 40 GHz 1 Watt Power Amplifier MMIC 37-40 GHz 1 Watt Power Amplifier MMIC DIODE SWITCHING DUAL-DUAL SERIES 240V 225mA-Io 350mW 50ns-trr SOT-26 3K/REEL
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| File Size |
464.86K /
10 Page |
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it Online |
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Price and Availability
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