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  1140-4377 Datasheet PDF File

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    1140-4031

Molex Electronics Ltd.
Part No. 1140-4031
Description Conductor Punch

File Size 14.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1140-4028

Molex Electronics Ltd.
Part No. 1140-4028
Description Insulation Punch

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-00LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 00 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4027

Molex Electronics Ltd.
Part No. 1140-4027
Description Conductor Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 78511-403HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    D1140

Toshiba Semiconductor
Part No. D1140
Description Search --To 2SD1140

File Size 224.30K  /  4 Page

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Amphenol Communications Solutions

Part No. 87401-140LF
Description Rib-Cage® Board To Board Connector, Surface Mount Vertical Shrouded PCB Header, 80 Positions, Plain Mounting style.
Tech specs    

Official Product Page

   
Part No. 1140-101K
Description 1 ELEMENT, 100 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR

File Size 19.26K  /  1 Page

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Amphenol Communications Solutions

Part No. 10027011-408HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Surface Mount, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4129

Molex Electronics Ltd.
Part No. 1140-4129
Description Barrel Form Punch

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 10027011-402HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Surface Mount, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4032

Molex Electronics Ltd.
Part No. 1140-4032
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-111140850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    IDD03E60 Q67040-S4377

Infineon Technologies A...
INFINEON[Infineon Technologies AG]
Part No. IDD03E60 Q67040-S4377
Description Fast Switching EmCon Diode
Silicon Power Diodes - 3A EmCon in TO252

File Size 179.78K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-811401800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    11-40-2091 1140-2091 0011-40-2091

Molex Electronics Ltd.
Part No. 11-40-2091 1140-2091 0011-40-2091
Description Terminator Die

File Size 19.43K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-40-2066 1140-2066 0011-40-2066

Molex Electronics Ltd.
Part No. 11-40-2066 1140-2066 0011-40-2066
Description Terminator Die - DOUBLES

File Size 19.46K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-15LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 1140-4377 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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