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  1140-390K Datasheet PDF File

For 1140-390K Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    11-40-2044 1140-2044 0011-40-2044

Molex Electronics Ltd.
Part No. 11-40-2044 1140-2044 0011-40-2044
Description Terminator Die - OVERLAP INSULATION CRIMP

File Size 20.06K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    11-40-2036 1140-2036 0011-40-2036

Molex Electronics Ltd.
Part No. 11-40-2036 1140-2036 0011-40-2036
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-00LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 00 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    53358-1140

Molex Electronics Ltd.
Part No. 53358-1140
Description 2.00mm (.049) Pitch Mi II Wire-to-Wire Adapter, 11 Circuits, Lead-free

File Size 130.52K  /  2 Page

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Amphenol Communications Solutions

Part No. 78511-403HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-40-2043 1140-2043 0011-40-2043

Molex Electronics Ltd.
Part No. 11-40-2043 1140-2043 0011-40-2043
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 87401-140LF
Description Rib-Cage® Board To Board Connector, Surface Mount Vertical Shrouded PCB Header, 80 Positions, Plain Mounting style.
Tech specs    

Official Product Page

    1140-4009 0011-40-4009

Molex Electronics Ltd.
Part No. 1140-4009 0011-40-4009
Description Insulation Punch

File Size 14.47K  /  1 Page

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Amphenol Communications Solutions

Part No. 10027011-408HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Surface Mount, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4017 0011-40-4017

Molex Electronics Ltd.
Part No. 1140-4017 0011-40-4017
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 10027011-402HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Surface Mount, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4015 0011-40-4015

Molex Electronics Ltd.
Part No. 1140-4015 0011-40-4015
Description Insulation Punch

File Size 14.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-111140850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    A-71395-1140

Molex Electronics Ltd.
Part No. A-71395-1140
Description 2.54mm (.100) Pitch C-Grid垄莽 PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 40 Circuits

File Size 736.43K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-811401800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    A-70475-1140

Molex Electronics Ltd.
Part No. A-70475-1140
Description
File Size 139.28K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-401-03LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Sanyo Semiconductor Corp
Part No. LA1140
Description Analog IC - Datasheet Reference
From old datasheet system

File Size 107.74K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-401-15LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

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