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wafer-frame Datasheet PDF File

For wafer-frame Found Datasheets File :: 950 Search Time::1.672ms
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				MICROCHIP[Microchip Technology]
Part No.	MCRF355 MCRF360
OCR Text	...Very low power CMOS design Die, wafer, bumped wafer, COB, PDIP or SOIC package options Package Type PDIP/SOIC VPRG CLK Ant. A NC Note: 1...frame, PDIP, SOIC and COB modules. Note: Information provided herein is preliminary and subjec...
Description	13.56 MHz Passive RFID Device with Anti-Collision Feature
File Size	564.90K / 23 Page	View it Online	Download Datasheet

				Aptina Imaging Corporation
Part No.	MT9N011
OCR Text	... r other thickness) ? back side wafer surface of bare silicon ? typical metal 2 thickness: 3.1k? ? typical metal 3 thickness: 3.1k? ? typica...frame rate ? full resolution: programmable up to 13.2 fps serial, 9.7 fps parallel ? vga: 640h x 4...
Description	9Mp CMOS Active-Pixel Digital Image Sensor
File Size	741.12K / 17 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	NTAG213 NT2H1311G0DUD NT2H1511G0DUD
OCR Text	...n nt2h1311g0duf ffc bump 8 inch wafer, 75 ? m thickness, on film frame carrier, electronic fail die marking according to secs-ii format), au bumps, 144 bytes user memory, 50 pf input capacitance - nt2h1311g0dud ffc bump 8 inch wafer, 120...
Description	NFC Forum Type 2 Tag compliant IC with 144/504/888 bytes user memory
File Size	1,482.90K / 58 Page	View it Online	Download Datasheet

				Aptina Imaging Corporation
Part No.	MT9N011
OCR Text	... r other thickness) ? back side wafer surface of bare silicon ? typical metal 2 thickness: 3.1k? ? typical metal 3 thickness: 3.1k? ? typica...frame rate ? full resolution: programmable up to 13.2 fps serial, 9.7 fps parallel ? vga: 640h x 4...
Description	9Mp CMOS Active-Pixel Digital Image Sensor Die
File Size	743.70K / 17 Page	View it Online	Download Datasheet

				EM Microelectronic - MARIN SA
Part No.	EM4200A6WS7-001 EM4200C4WS7-002 EM4200EXWS7-003 EM4200B5WS7-006 EM4200C4WS7-008 EM4200A6WB11E-051 EM4200
OCR Text	... 250pF 75pF Custom Package Sawn wafer Die Sawn wafer Sawn wafer Sawn wafer Sawn wafer Custom Delivery Form Wafer on frame Blister Tape Wafer on frame Wafer on frame Wafer on frame Wafer on frame Custom Copyright (c) 2009, EM Microelectro...
Description	128 bit Read Only Low Frequency Contactless Identification Device
File Size	42.21K / 1 Page	View it Online	Download Datasheet

				Aptina Imaging Corporation
Part No.	MT9M114
OCR Text	...ith a standard probe (c1) test. wafer probe is performed at an elevated temperature to test product functionality in aptina?s standard pa...frame_valid pixclk line_valid s addr gnd_pll a gnd v dd _phy i/o 5 power digital core power v dd ...
Description	1/6-Inch 720P High-Definition (HD) System-On-A-Chip (SOC) Digital Image Sensor Die
File Size	474.34K / 11 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	MADS-002502-1246HP MADS-002502-1246LP MADS-002502-1246MP MA4E2502H-1246 MA4E2502H-1246T MA4E2502H-1246W MA4E2502L-1246 MA4E2502L-1246T MA4E2502L-1246W MA4E2502 MA4E2502H MA4E2502M-1246W MA4E2502M-1246T
OCR Text	...M Products Rev. V7 Package Wafer on Frame Die in Carrier Surf Tape on Reel Pocket Tape on Reel Wafer on Frame Die in Carrier Surf Tape on Reel Pocket Tape on Reel Wafer on Frame Die in Carrier Surf Tape on Reel Pocket Tape on Reel M...
Description	SILICON, HIGH BARRIER SCHOTTKY, KU BAND, MIXER DIODE SURMOUNTTM Low, Medium, and High Barrier Silicon Schottky Diodes
File Size	106.93K / 5 Page	View it Online	Download Datasheet

				Philips
Part No.	SL1ICS3101 SL1ICS3101W/N4D
OCR Text	...ce test Visual inspection After wafer final test After sawing (film frame carrier) HANDLING INSTRUCTIONS ELECTRICAL CHARACTERISTICS MECHANICAL CHARACTERISTICS Die specifications Wafer specifications APPLICATION INFORMATION Protection agains...
Description	SL1ICS3101; I-CODE1 Label IC (97 pF)
File Size	152.46K / 20 Page	View it Online	Download Datasheet

				Philips
Part No.	SL1ICS3001 SL1ICS3001W/N4D
OCR Text	...ce test Visual inspection After wafer final test After sawing (film frame carrier) HANDLING INSTRUCTIONS ELECTRICAL CHARACTERISTICS MECHANICAL CHARACTERISTICS Die specifications Wafer specifications APPLICATION INFORMATION Protection agains...
Description	SL1ICS3001; I-CODE1 Label IC
File Size	152.22K / 20 Page	View it Online	Download Datasheet

For wafer-frame Found Datasheets File :: 950 Search Time::1.672ms
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