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| Part No. |
AN-9037
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| OCR Text |
... voiding, and should carefully study the process design with x-ray inspection of voiding to assure the design is yielding th e expected performance. there are several types of via. blind vias are not recommended due to the fact they ... |
| Description |
8x8 MLP DriverMOS Packaging
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| File Size |
749.51K /
7 Page |
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TIANMA
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| Part No. |
TM150XG-26L07 TM150XG26L07
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| OCR Text |
...t prior notice. when you kindly study to use this product, please ask us or our distributor for the latest information. 2. this product is developed and produced for usage onto normal electronic products (office automation equipments, ... |
| Description |
LCD_Module
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| File Size |
225.50K /
14 Page |
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SGS Thomson Microelectronics
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| Part No. |
AN1485
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| OCR Text |
...alyzed and quantified in a case study regarding a dc-dc boost converter, which is used in a power factor corrector (pfc) converter. results obtained from the analysis of the electrical and thermal behavior of the component in the specific a... |
| Description |
MDMESH(TM) PERFORMANCE EVALUATION IN A CONTINUOUS MODE PFC BOOST CONVERTER
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| File Size |
215.12K /
14 Page |
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Vishay Intertechnology,Inc.
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| Part No. |
AN610
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| OCR Text |
...ints, which in turn enables the study of solder joint reliability. The design of experiment (DOE) consists of two phases. The first phase is process development discussed in the application note titled "Development of Lead-free soldering pr... |
| Description |
PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701
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| File Size |
1,202.85K /
17 Page |
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http://
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| Part No. |
AN-9040
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| OCR Text |
... voiding, and should carefully study the process design with x- ray inspection of voiding to assure the design is yielding the expected pe rformance. there are several types of via. blind vias are not recommended due to the fact they ... |
| Description |
Power33 Packaging
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| File Size |
299.73K /
7 Page |
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it Online |
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