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Part No. AN-9037
OCR Text ... voiding, and should carefully study the process design with x-ray inspection of voiding to assure the design is yielding th e expected performance. there are several types of via. blind vias are not recommended due to the fact they ...
Description 8x8 MLP DriverMOS Packaging

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    AN1506

STMicroelectronics
SGS Thomson Microelectronics
Part No. AN1506
OCR Text ... unacceptably high. in the case study an injected current value of 80a in the motor will cause about 0.5 v-0.7v voltage drop in the used mosfet, which is quite acceptable. the mechanical actuators of the drives are two permanent magnet brus...
Description A MOTOR DRIVES SYSTEM FOR WHEELCHAIR APPLICATIONS

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    TIANMA
Part No. TM150XG-26L07 TM150XG26L07
OCR Text ...t prior notice. when you kindly study to use this product, please ask us or our distributor for the latest information. 2. this product is developed and produced for usage onto normal electronic products (office automation equipments, ...
Description LCD_Module

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    SGS Thomson Microelectronics
Part No. AN1485
OCR Text ...alyzed and quantified in a case study regarding a dc-dc boost converter, which is used in a power factor corrector (pfc) converter. results obtained from the analysis of the electrical and thermal behavior of the component in the specific a...
Description MDMESH(TM) PERFORMANCE EVALUATION IN A CONTINUOUS MODE PFC BOOST CONVERTER

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    Vishay Intertechnology,Inc.
Part No. AN610
OCR Text ...ints, which in turn enables the study of solder joint reliability. The design of experiment (DOE) consists of two phases. The first phase is process development discussed in the application note titled "Development of Lead-free soldering pr...
Description PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701

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    TEA2028 TEA2028-TEA2029 TEA2029 TEA2028-BTEA2029

ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
Part No. TEA2028 TEA2028-TEA2029 TEA2029 TEA2028-BTEA2029
OCR Text ... . . . . . . . . . . . . . . d. study of the Internal Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . e. Characteristics of the non-linear Amplifier "A4" . . . . . . . . . . . . . . . . . . . . . ...
Description APPLICATION NOTE

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Part No. AN-9040
OCR Text ... voiding, and should carefully study the process design with x- ray inspection of voiding to assure the design is yielding the expected pe rformance. there are several types of via. blind vias are not recommended due to the fact they ...
Description Power33 Packaging

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    LSM-0.8_10-D12EB LSM-0.8_10-D3EB LSM-0.8_10-D5EB LSM-1.2_10-D5EB LSM-1.5_10-D5EB LSM-1.8_10-D5EB LSM-1_10-D5EB LSM-2.5_1

Murata Manufacturing Co., Ltd.
Part No. LSM-0.8_10-D12EB LSM-0.8_10-D3EB LSM-0.8_10-D5EB LSM-1.2_10-D5EB LSM-1.5_10-D5EB LSM-1.8_10-D5EB LSM-1_10-D5EB LSM-2.5_10-D5EB LSM-2_10-D5EB LSM-3.3_10-D5EB LSM-0.8/10-D5EB LSM-2.5/10-D5EB LSM-3.3/10-D5EB LSM-2/10-D5EB LSM-1/10-D5EB LSM-1.8/10-D5EB LSM-1.5/10-D5EB LSM-1.2/10-D5EB LSM-0.8/10-D3EB LSM-0.8/10-D12EB LSM-1.2/10-D3EB LSM-1.5/10-D3EB LSM-1.8/10-D3EB LSM-1/10-D3EB LSM-2.5/10-D3EB LSM-2.5/10-D12EB LSM-1.2/10-D12EB LSM-3.3/10-D12EB LSM-1.5/10-D12EB LSM-1.8/10-D12EB LSM-1/10-D12EB LSM-2/10-D3EB
OCR Text ...t noise pickup and instability. study the LSM data sheet for the required resistor values. Thermal Considerations The DC/DC converter, when mounted on the evaluation board, is rated up to approximately +65 degrees Centrigrade operation (dep...
Description 10 Amp DC/DC Power Converter Evaluation Boards

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    LT1E90A

Sharp Electrionic Components
Part No. LT1E90A
OCR Text ...etc. Therefore please check and study your solder reflow machine's beat condition. (2) Reflow soldering temper&u-e profile to be done under the following condition. Time(s) Recommendable Thermal Model (3) Recommendable Metal Mask pat...
Description DEVICE SPECIFICATION FOR Light Emitting Diode

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