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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI168L2200G9-T
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| OCR Text |
... 1.6x0.8x0.65mm for w-cdma/cdma/gsm/lte lifecycle stage mass production standard packaging quantity (minimum) taping papered 5000 products characteristics table system w-cdma/cdma/gsm/lte passband frequency1 (f1) 1700 to 2700 mhz insertion ... |
| Description |
Multilayer Ceramic Devices (Low Pass Type)
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| File Size |
241.43K /
2 Page |
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it Online |
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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI168L0628M4-T
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| OCR Text |
... 1.6x0.8x0.65mm for w-cdma/cdma/gsm/lte lifecycle stage mass production standard packaging quantity (minimum) taping papered 4000 products characteristics table system w-cdma/cdma/gsm/lte passband frequency1 (f1) 470 to 787 mhz insertion lo... |
| Description |
Multilayer Ceramic Devices (Low Pass Type)
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| File Size |
244.34K /
2 Page |
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it Online |
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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI168K1687AA-T
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| OCR Text |
gsm/lte/ism900/bluetooth/ w-lan/wimax/gps lifecycle stage mass production standard packaging quantity (minimum) taping papered 8000 products characteristics table system w-cdma/cdma/gsm/lte /ism900/bluetooth/w-lan/wimax/gps passband frequen... |
| Description |
Multilayer Ceramic Devices (Coupler)
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| File Size |
242.87K /
2 Page |
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it Online |
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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI168D087018-T
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| OCR Text |
... 1.6x0.8x0.45mm for w-cdma/cdma/gsm/lte lifecycle stage mass production standard packaging quantity (minimum) taping papered 4000 products characteristics table system w-cdma/cdma/gsm/lte frequency1 low band passband frequency1 (f1) 824 to ... |
| Description |
Multilayer Ceramic Devices (Dual Type)
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| File Size |
251.36K /
2 Page |
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it Online |
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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI168P157519-T
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| OCR Text |
gsm/ism900/bluetooth/w-l an/gps lifecycle stage mass production standard packaging quantity (minimum) taping papered 4000 products characteristics table system w-cdma/cdma/gsm/ism900 /bluetooth/w-lan/gps frequency1 low band passband frequen... |
| Description |
Multilayer Ceramic Devices (Diplexers)
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| File Size |
242.43K /
2 Page |
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it Online |
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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI105L087038-T
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| OCR Text |
gsm lifecycle stage mass production standard packaging quantity (minimum) taping papered 10000 products characteristics table system gsm passband frequency1 (f1) 824 to 915 mhz insertion loss2 (max)(in f1) 0.75 db at 824 to 915mhz (-30 to +... |
| Description |
Multilayer Ceramic Devices (Low Pass Type)
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| File Size |
237.69K /
2 Page |
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it Online |
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Filtronic Compound Semi...
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| Part No. |
FMS2010-000-WP
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| OCR Text |
... fms2010 sp6t gaas multi-band gsm antenna switch features: ? available in die form ? suitable for multi-band gsm/dcs/pcs/edge applications ? excellent low control voltage performance ? excellent harmonic performan... |
| Description |
SP6T GaAs Multi-Band gsm Antenna Switch
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| File Size |
256.17K /
6 Page |
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it Online |
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Freescale Semiconductor...
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| Part No. |
MRF6S9125NR1
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| OCR Text |
... - 47.1 dbc in 30 khz bandwidth gsm edge application ? typical gsm edge performance: v dd = 28 volts, i dq = 700 ma, p out = 60 watts avg., full frequency band (865 - 960 mhz or 921 - 960 mhz) power gain ? 20 db drain efficiency ? 40% ... |
| Description |
RF Power Field Effect Transistors
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| File Size |
911.23K /
23 Page |
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it Online |
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Japan Aviation Electron...
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| Part No. |
SF9-STS1-A SF9W006S4A
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| OCR Text |
...im card connector compatible to gsm 11.11 standard [outline] sf9 series is a tray type connecto r compatible with gsm 11.11 standard plug in sim card for gsm mobile phones. (sim: subscriber identification module) general specification ?tra... |
| Description |
COMPONENTS PRODUCT INFORMATION
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| File Size |
156.15K /
4 Page |
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it Online |
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