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Amphenol Communications Solutions |
| Part No. |
70451-2019LF
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| Description |
4 Row Signal Header, 72 Position, Straight, Press-Fit, Wide body
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
85758-1201LF
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| Description |
Metral® Board Connectors, Backplane Connectors, 4 Row Signal Receptacle, Straight, Press-Fit.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51700-10101201ACLF
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| Description |
PwrBlade®, Power Supply Connectors, 1P 12S 1 STB Vertical Header.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
74221-201LF
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| Description |
400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10116951-2010HLF
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| Description |
CXP Passive Copper Cable Assemblies, Passive, 10Gb/s, 30 AWG, 1.0m, Halogen free
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
90312-014LF
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| Description |
Crimp-to-Wire Housing, Single Row, Pol. w/Latch, 14 Position
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
55741-201
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| Description |
GIG-Array®, Mezzanine Connectors, 15mm Recetpacle 200 Position .
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-60-1201 70400-0404 A-70400-0404 0014601201
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| Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 28, 3.81μm (150μ) Tin/Lead (SnPb), 20 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 28, 3.81μm (150μ) Tin/Lead (SnPb), 20 Circuits
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| File Size |
159.03K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
90312-011LF
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| Description |
Crimp-to-Wire Housing, Single Row, Pol. w/Latch, 11 Position
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0348 15-80-1201 0015801201
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
108-1411-201
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, Guide Module, Ground Contact, No Key.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-201HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch.
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Official Product Page
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Price and Availability
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