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  BSC22-0136 Datasheet PDF File

For BSC22-0136 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90136-2122

Molex Electronics Ltd.
Part No. 90136-2122
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 22 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 10136353-12111LF
Description Minitek® 1.5mm Wire to Board Receptacle Right Angle Surface Mount Type, Tin plating, 12 positions
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    90136-2110

Molex Electronics Ltd.
Part No. 90136-2110
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.53K  /  5 Page

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Amphenol Communications Solutions
Part No. 10136647-051131LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 5 Positions, GW Compatible, with Posts, Tray packing.
Tech specs 　 　

Official Product Page

    90136-2112

Molex Electronics Ltd.
Part No. 90136-2112
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 10136654-0542LF
Description Minitek® Pwr 3.0, Single Row, Right Angle Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 5 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    90136-2103

Molex Electronics Ltd.
Part No. 90136-2103
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.53K  /  5 Page

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Amphenol Communications Solutions
Part No. 10136647-031141LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 3 Positions, Non GW Compatible, with Posts, Tray packing.
Tech specs 　 　

Official Product Page

    90136-1202

Molex Electronics Ltd.
Part No. 90136-1202
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 159.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 10136647-032132LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, Gold Flash plating, Natural Color, 3 Positions, GW Compatible, without Posts, Tray packing.
Tech specs 　 　

Official Product Page

    90136-1206

Molex Electronics Ltd.
Part No. 90136-1206
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 159.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 10136647-031132LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 3 Positions, GW Compatible, without Posts, Tray packing.
Tech specs 　 　

Official Product Page

    90136-1205

Molex Electronics Ltd.
Part No. 90136-1205
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 159.24K  /  4 Page

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Amphenol Communications Solutions
Part No. 10136647-031112LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Natural Color, 3 Positions, GW Compatible, without Posts, Tray packing.
Tech specs 　 　

Official Product Page

    90136-2109

Molex Electronics Ltd.
Part No. 90136-2109
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 9 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.53K  /  5 Page

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Amphenol Communications Solutions
Part No. 10136654-0511LF
Description Minitek® Pwr 3.0, Single Row, Right Angle Through Hole Header, Tin plating, 5 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    90136-2108

Molex Electronics Ltd.
Part No. 90136-2108
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.53K  /  5 Page

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Amphenol Communications Solutions
Part No. 10136654-0222LF
Description Minitek® Pwr 3.0, Single Row, Right Angle Through Hole Header, Gold Flash plating, 2 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    90136-2107

Molex Electronics Ltd.
Part No. 90136-2107
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
File Size 254.53K  /  5 Page

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Amphenol Communications Solutions
Part No. 10136656-0821LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 8 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

For BSC22-0136 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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