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bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 130 Search Time::3.735ms
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				Maxim Integrated Products MAXIM - Dallas Semiconductor Maxim Integrated Produc...
Part No.	MAXIM6012 MAXIM6018 MAXIM6021 MAXIM6025 MAXIM6030 MAXIM6035 MAXIM6041 MAXIM6050 MAXIM6061 MAXIM6062 MAXIM6063 MAXIM6064 MAXIM6065 MAXIM6066 MAXIM6068 MAX6100EUR MAXIM6067 MAXIM60B12 MAXIM60B18 MAXIM602B1 MAXIM606B1 MAXIMINTEGRATEDPRODUCTSINC.-MAXIM6012
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 44 x 31mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 mil....
Description	PLASTIC ENCAPSULATED DEVICES
File Size	87.51K / 8 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX5307EUE
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 102 x 141 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 0.6 microns (as drawn) 0.6 microns (as drawn) 5 m...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	97.49K / 8 Page	View it Online	Download Datasheet

				MAXIM[Maxim Integrated Products]
Part No.	MAX5306 MAX5307 MAX5308 MAX5309 MAX5309EUE
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 102 x 141 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 0.6 microns (as drawn) 0.6 microns (as drawn) 5 m...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	95.10K / 8 Page	View it Online	Download Datasheet

				MAXIM[Maxim Integrated Products]
Part No.	MAX1567ETL
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 127 x 147 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Silicon None .8 microns (as drawn) .8 microns (as drawn) 5 m...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	126.18K / 8 Page	View it Online	Download Datasheet

				MACOM[Tyco Electronics]
Part No.	MADA2030G
OCR Text	...Operating Temperature: +175C bondpad Dimensions Inches (mm) Wire Bonding A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Thermo- sonic wirebonding with a nominal stage temperature of 150C and a ball bonding force of 40 to...
Description	5-Bit GaAs Digital Attenuator DC - 2 GHz
File Size	97.83K / 2 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products] Maxim Integrated Produc...
Part No.	MAX8546EUB MAX1967EUB
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 58 x 72 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 0.8 microns (as drawn) 0.8 microns (as drawn) 5 mil...
Description	PLASTIC ENCAPSULATED DEVICES Low-Cost / Wide Input Range / Step-Down Controllers with Foldback Current Limit Low-Cost, Wide Input Range, Step-Down Controllers with Foldback Current Limit
File Size	89.42K / 8 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX8562 MAX8560 MAX8561 MAX8561ETA
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 40 x 59 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 0.8 microns (as drawn) 0.8 microns (as drawn) 5 mil...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	93.73K / 8 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor ETC[ETC] List of Unclassifed Manufacturers
Part No.	MAX823SEXK
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 42 x 36 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 mil...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	130.89K / 9 Page	View it Online	Download Datasheet

				MAXIM[Maxim Integrated Products]
Part No.	MAX3295AUT MAX3295 MAX3293 MAX3294
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 75 x 45 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 0.8 microns (as drawn) 0.8 microns (as drawn) 5 mil...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	98.51K / 8 Page	View it Online	Download Datasheet

				Intersil, Corp. HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
Part No.	MSA-0900 MSA-0900-GP4
OCR Text	...backside contact) Ground (4) bondpad FOR FEEDBACK CAPACITOR AK 335 m 13.2 mil (1) INPUT 450 m 17.7 mil OPTIONAL TOPSIDE (5) OUTPUT[1] 6-433 Unless otherwise specified, tolerances are 13 m/0.5 mils. Chip thickness is ...
Description	Cascadable Silicon Bipolar MMIC Amplifier 级联硅双极MMIC放大
File Size	50.54K / 4 Page	View it Online	Download Datasheet

For bondpad Found Datasheets File :: 130 Search Time::3.735ms
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