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adhesive Datasheet PDF File

For adhesive Found Datasheets File :: 7245 Search Time::4.329ms
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				TDK Electronics
Part No.	SDR08540M3-01
OCR Text	...nsion stresses from the mold or adhesive agent may cause deterioration in a soldered terminal part. Before molding or securing an adhesive, consider the type, Oscillator circuit Q amount, hardening conditions, adhesive properties, etc., of ...
Description	Electromagnetic Buzzers
File Size	49.97K / 4 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	ILX548K
OCR Text	...N 29N 29N 0.9Nm Ceramic portion adhesive (1) (2) (3) (4) ;; ; ;;; ;; ;; ;; ;;; ; ;; ;;; ; ;;; b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, ...
Description	5340 pixel × 3 line CCD Linear Sensor (Color) 5340 pixel 】 3 line CCD Linear Sensor (Color) 5340 pixel 3 line CCD Linear Sensor (Color) 5340pixel x 3line CCD Linear Sensor(Color)
File Size	132.94K / 11 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	UBA1710M
OCR Text	...must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maxi...
Description	Modulator for GaAs power amplifiers
File Size	58.92K / 12 Page	View it Online	Download Datasheet

				3M Electronics
Part No.	AB-5000 AB-5050 AB-5030 AB-5020 AB-5100 AB5050
OCR Text	...with acrylic pressure-sensitive adhesive. * Polymer resin and metal flakes filler * Acrylic pressure-sensitive adhesive * Supplied on a removable liner for easy handling and die-cutting The AB-5000 Series EMI Absorber is available in standa...
Description	EMI Absorber
File Size	191.24K / 2 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	HTRC12002B
OCR Text	...must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activa...
Description	HITAG co-processor
File Size	54.43K / 8 Page	View it Online	Download Datasheet

				Philips
Part No.	CGY2105ATS/C1
OCR Text	...must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activ...
Description	CGY2105ATS; High dynamic range dual LNA MMIC
File Size	88.58K / 16 Page	View it Online	Download Datasheet

				Philips
Part No.	CGY2032TSC1
OCR Text	...must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activ...
Description	DECT 500 mW power amplifier
File Size	61.54K / 12 Page	View it Online	Download Datasheet

				Philips
Part No.	CGY2030MC1
OCR Text	...must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and max...
Description	DECT 500 mW power amplifier
File Size	94.58K / 12 Page	View it Online	Download Datasheet

				Philips
Part No.	CGY2020G
OCR Text	...must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and max...
Description	DCS 2 W power amplifier
File Size	72.02K / 12 Page	View it Online	Download Datasheet

				Marktech Corporate
Part No.	MT3418A-UY-A
OCR Text	...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description	5.0mm ROUND LED LAMP
File Size	127.36K / 6 Page	View it Online	Download Datasheet

For adhesive Found Datasheets File :: 7245 Search Time::4.329ms
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