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  87758-2017 Datasheet PDF File

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    87758-2416

Molex Electronics Ltd.
Part No. 87758-2416
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits, 0.38μm 15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TPD2017FN
Description Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87758-2417

Molex Electronics Ltd.
Part No. 87758-2417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-108201750LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87758-1417

Molex Electronics Ltd.
Part No. 87758-1417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 14 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-201-72LF
Description BERGSTIK
Tech specs    

Official Product Page

    87758-1617

Molex Electronics Ltd.
Part No. 87758-1617
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-110201700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87758-1816

Molex Electronics Ltd.
Part No. 87758-1816
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 59202-F40-20-174LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs    

Official Product Page

    87758-1817

Molex Electronics Ltd.
Part No. 87758-1817
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 59202-G40-20-174LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs    

Official Product Page

    87758-4250

Molex Electronics Ltd.
Part No. 87758-4250
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 42 Circuits

File Size 135.47K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109201700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87758-4217

Molex Electronics Ltd.
Part No. 87758-4217
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.41K  /  4 Page

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Amphenol Communications Solutions

Part No. 67292-017
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 34 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    87758-4216

Molex Electronics Ltd.
Part No. 87758-4216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 72017-212LF
Description 5 Row Signal Receptacle, 150 Position, Straight, Solder to Board
Tech specs    

Official Product Page

    87758-2450

Molex Electronics Ltd.
Part No. 87758-2450
Description 2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 90312-017LF
Description Crimp-to-Wire Housing, Single Row, Pol. w/Latch, 17 Position
Tech specs    

Official Product Page

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