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  8324 Datasheet PDF File

For 8324 Found Datasheets File :: 83+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 |   

    0878324821 87832-4821

Molex Electronics Ltd.
Part No. 0878324821 87832-4821
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 48 Circuits, 0.76μm (30μ) Gold (Au) Plating
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree, 48 Circuits, 0.76μm (30μ) Gold (Au) Plating
MOLEX Connector

File Size 386.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 86094328324H55V1LF
Description DIN Headers & Receptacles, Backplane Connector, Standard Receptacle, Vertical, Through Hole, Style C/2, 32 ways, Class II, with Harpoons
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0878324820 87832-4820

Molex Electronics Ltd.
Part No. 0878324820 87832-4820
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 48 Circuits, 0.38μm (15μ) Gold (Au) Plating
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree, 48 Circuits, 0.38μm (15μ) Gold (Au) Plating
MOLEX Connector

File Size 367.67K  /  6 Page

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Amphenol Communications Solutions

Part No. 86093488324H65V1LF
Description DIN Headers & Receptacles, Backplane Connector, Standard Receptacle, Vertical, Through Hole, Style C/2, 48 ways, Class I, with Harpoons
Tech specs    

Official Product Page

    D945GCPE D98324-001US

Intel Corporation
Part No. D945GCPE D98324-001US
Description Technical Product Specification

File Size 3,070.95K  /  80 Page

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Amphenol Communications Solutions

Part No. 86832-406HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 6 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

    KS88C8324 KS88C8316

SAMSUNG[Samsung semiconductor]
Part No. KS88C8324 KS88C8316
Description SAM87 family of 8-bit single-chip CMOS microcontrollers offers a fast and efficient CPU

File Size 89.81K  /  19 Page

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Amphenol Communications Solutions

Part No. 86832-426HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

    Electronic Theatre Controls, Inc.
Part No. M13S128324A
Description Modify typing error of Pin Arrangement 修改输入错误的管脚配

File Size 805.48K  /  48 Page

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Amphenol Communications Solutions

Part No. 86832-446HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

    Elite Semiconductor Mem...
Part No. M53S128324A-2E
Description Bi-directional data strobe (DQS)

File Size 1,159.84K  /  47 Page

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Amphenol Communications Solutions

Part No. 86832-466HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 66 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

    Elite Semiconductor Mem...
Part No. M13S128324A-2M
Description Double-data-rate architecture, two data transfers per clock cycle

File Size 1,155.09K  /  48 Page

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Amphenol Communications Solutions

Part No. 86093488324785V1LF
Description DIN Headers & Receptacles, Backplane Connector, Standard Receptacle, Vertical, Through Hole, Style C/2, 48 ways, Mil - Class
Tech specs    

Official Product Page

    Elite Semiconductor
Part No. M12L128324A
Description Dynamic RAM

File Size 790.23K  /  46 Page

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Amphenol Communications Solutions

Part No. 86094328324755V1LF
Description DIN Headers & Receptacles, Backplane Connector, Standard Receptacle, Vertical, Through Hole, Style C/2, 32 ways, Class II
Tech specs    

Official Product Page

    10-88-3241 0010883241 70216-0089

Molex Electronics Ltd.
Part No. 10-88-3241 0010883241 70216-0089
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, High Profile, Dual Row, Right Angle, 24 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 119.88K  /  6 Page

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Amphenol Communications Solutions

Part No. 68683-241LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 82 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    M13S128324A

Elite Semiconductor Memory Technology Inc.
Part No. M13S128324A
Description 1M x 32 Bit x 4 Banks Double Data Rate SDRAM

File Size 865.01K  /  49 Page

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Amphenol Communications Solutions

Part No. 86832-414HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

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