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20121 2012SYCK 13014 40CPQ080 BSW40 40CPQ100 RT0608 SP432
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  73780-3163 Datasheet PDF File

For 73780-3163 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    73780-2157

Molex Electronics Ltd.
Part No. 73780-2157
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.50mm (.138),

File Size 198.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163402PLF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73780-2147

Molex Electronics Ltd.
Part No. 73780-2147
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits

File Size 194.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 91901-31631LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 31 Positions.
Tech specs    

Official Product Page

    73780-3153

Molex Electronics Ltd.
Part No. 73780-3153
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 13.00mm (.512), Pin Length 3.50mm (.138),
2.00mm (.079") Pitch HDM垄莽 Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 13.00mm (.512"), Pin Length 3.50mm (.138

File Size 198.98K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6316-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    73780-2133

Molex Electronics Ltd.
Part No. 73780-2133
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 2.50mm (.098),

File Size 236.74K  /  3 Page

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Amphenol Communications Solutions

Part No. 75168-316-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    73780-2257

Molex Electronics Ltd.
Part No. 73780-2257
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.50mm (.138),

File Size 198.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163400LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    73780-2256

Molex Electronics Ltd.
Part No. 73780-2256
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 16.00mm (.630), Pin Length 3.50mm (.138),

File Size 198.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    73780-2255

Molex Electronics Ltd.
Part No. 73780-2255
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits

File Size 198.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    73780-3155

Molex Electronics Ltd.
Part No. 73780-3155
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted Height 15.00mm (.591), Pin Length 3.50mm (.138), Press Fit

File Size 198.42K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163622LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    73780-3256

Molex Electronics Ltd.
Part No. 73780-3256
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 16.00mm (.630), Pin Length 3.50mm (.138),

File Size 198.71K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6314-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    73780-3257

Molex Electronics Ltd.
Part No. 73780-3257
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.50mm (.138),

File Size 198.71K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6318-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

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