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  70543-0021 Datasheet PDF File

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    Molex, Inc.
Part No. 70543-0251 70543-0045 70543-0248 70543-0278 70543-0272 70543-0166 70543-0167 70543-0058 70543-0201
Description CGRID SL VHDR TIN 5 CKT 5 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
Header; No. of Contacts:11; Pitch Spacing:2.54mm; No. of Rows:1; Series:SL; Connector Body Material:Polyester; Mounting Type:PC Board; Terminal Type:Straight Pin 11 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR TIN 2 CKT 2 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR 15 GOLD 8 CKT 8 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR 15 GOLD 2 CKT 2 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL SMT Vhdr SR 150 30 SAu 3Ckt 3 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR SR 30 GOLD 4CKT 4 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL Srd VHdr SR 120 Tin 24Ckt 24 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL SMT Vhdr SR 120 15 SAu 3Ckt 3 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

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Amphenol Communications Solutions

Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0705430110

Molex Electronics Ltd.
Part No. 0705430110
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 6Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    0705430121

Molex Electronics Ltd.
Part No. 0705430121
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 17Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    0705430120

Molex Electronics Ltd.
Part No. 0705430120
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 16 Circuits, 0.76um

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-432HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    0705430119

Molex Electronics Ltd.
Part No. 0705430119
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 15Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.16K  /  4 Page

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Amphenol Communications Solutions

Part No. 94937-0543LF
Description Header, Top Mount, Upper Deck(68Pins), 5V, 4.3mm s/o
Tech specs    

Official Product Page

    0705430118

Molex Electronics Ltd.
Part No. 0705430118
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-431HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    0705430117

Molex Electronics Ltd.
Part No. 0705430117
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 13Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 61127-0543LF
Description Header, Top Mount, Upper Deck(68Pins), VTB, 3.3V, 4.3mm s/o
Tech specs    

Official Product Page

    0705430114

Molex Electronics Ltd.
Part No. 0705430114
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 10 Circuits, 0.76um

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    0705430113

Molex Electronics Ltd.
Part No. 0705430113
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 9Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021221-00214C8LF
Description Minitek127® 1.27mm Wire/Cable-to-Board Connector System, Shrouded vertical header, Surface Mount, Double Row, 14 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    0705430112

Molex Electronics Ltd.
Part No. 0705430112
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 8Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021112-00214T1LF
Description R/A DIP TYPE HEADER
Tech specs    

Official Product Page

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