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15ACD 53204 4501M 005L55F 1SMC5373 74HCT5 K7055 AMS34063
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  70287-1211 Datasheet PDF File

For 70287-1211 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    70287-1224

Molex Electronics Ltd.
Part No. 70287-1224
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 60 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 308.36K  /  6 Page

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Amphenol Communications Solutions

Part No. 10136353-12111LF
Description Minitek® 1.5mm Wire to Board Receptacle Right Angle Surface Mount Type, Tin plating, 12 positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70287-1221

Molex Electronics Ltd.
Part No. 70287-1221
Description 2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 54 Circuits, 6.10mm (.240)

File Size 308.37K  /  6 Page

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Amphenol Communications Solutions

Part No. 54112-110102000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70287-1085

Molex Electronics Ltd.
Part No. 70287-1085
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 76 Circuits, 8.13mm (.320) Mating Pin Length, Tin (Sn) Plating

File Size 303.42K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-110062000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70287-1081

Molex Electronics Ltd.
Part No. 70287-1081
Description 2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 68 Circuits, 8.13mm

File Size 303.42K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-112400900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70287-1087

Molex Electronics Ltd.
Part No. 70287-1087
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 80 Circuits, 8.13mm (.320) Mating Pin Length, Tin (Sn) Plating

File Size 303.42K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-110402100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70287-1086

Molex Electronics Ltd.
Part No. 70287-1086
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 78 Circuits, 8.13mm (.320) Mating Pin Length, Tin (Sn) Plating

File Size 303.42K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021211-00006T8LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 6 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    70287-1088

Molex Electronics Ltd.
Part No. 70287-1088
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 82 Circuits, 8.13mm (.320) Mating Pin Length, Tin (Sn) Plating

File Size 303.29K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-110101700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    70287-1084

Molex Electronics Ltd.
Part No. 70287-1084
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 74 Circuits, 8.13mm (.320) Mating Pin Length, Tin (Sn) Plating

File Size 303.42K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131319-12111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 12 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    70287-1082

Molex Electronics Ltd.
Part No. 70287-1082
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 70 Circuits, 8.13mm (.320) Mating Pin Length, Tin (Sn) Plating

File Size 303.42K  /  5 Page

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Amphenol Communications Solutions

Part No. 10137925-1211LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 12 Positions, GW Compatible LCP, Tape and Reel. .
Tech specs    

Official Product Page

    TE Connectivity Ltd
Part No. 2170287-6 2170287-7 2170287-5 2170287-9
Description    THIS DRAWING IS A CONTROLLED DOCUMENT.

File Size 2,827.86K  /  8 Page

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Amphenol Communications Solutions

Part No. 20021211-00012T1LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 12 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

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